Liquid Cooling Heat Dissipation System for Rack-Mount Servers
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Solution Overview
Problem
Conventional rack-mount servers rely on heat sinks and system fans for heat dissipation, which is inefficient and can cause damage to electronic components due to slow heat removal.
Innovation Solution
A heat dissipation device comprising a heat-absorbing member with fins and connecting pipes, utilizing cooled water to transfer heat from electronic components to fins and then to the water, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If heat sinks and system fans are used for heat dissipation, then the structure is simple, but the heat dissipation efficiency is low
Solution Approach 1:
The patent introduces a liquid cooling system where coolant flows through channels in the heat dissipation device, directly contacting the heat-conductive material to absorb heat from electronic components. This hydraulic approach replaces the insufficient air-based convection of fans with efficient liquid-based heat transfer, resolving the contradiction between structural simplicity and heat dissipation efficiency.
Solution Approach 2:
The patent uses a heat-conductive material as an intermediary between the electronic component and the coolant. This intermediary efficiently transfers heat from the component to the liquid cooling system, enabling high-speed heat removal while maintaining a relatively simple overall structure that integrates the cooling function directly into the mounting device.
2Device complexity
If heat sinks and system fans are used, then the device complexity is low, but the heat removal speed is slow
Solution Approach 1:
By implementing a liquid cooling system with coolant flowing through integrated channels, the patent achieves rapid heat removal. The liquid coolant continuously circulates, absorbing heat at high speed from electronic components through direct contact with heat-conductive material, thereby dramatically increasing heat removal speed without significantly increasing device complexity.
Solution Approach 2:
The cooling system operates continuously with coolant constantly flowing through the heat dissipation device, ensuring uninterrupted heat removal. This continuous action prevents heat accumulation and maintains high heat removal speed, addressing the limitation of intermittent or insufficient cooling in conventional fan-based systems.
3Device complexity
If conventional heat dissipation methods are used, then the system is simple, but heat dissipation is inefficient causing component damage
Solution Approach 1:
The liquid cooling system provides efficient and reliable heat dissipation by using coolant flow to continuously remove heat from electronic components. This prevents overheating and potential component damage, significantly improving reliability while maintaining relatively simple system integration through the built-in heat dissipation device.
Solution Approach 2:
The heat-conductive material serves as a reliable intermediary that ensures efficient heat transfer from the electronic component to the coolant. This reliable heat transfer pathway prevents temperature buildup at the component interface, protecting against thermal damage and enhancing overall system reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed heat dissipation system effectively removes heat from electronic components, preventing damage by utilizing a combination of heat-conductive materials and fluid-based heat transfer, improving the efficiency of heat dissipation in rack-mount servers.
Implementation Method 1
a bottom surface of the base opposite to the fins contacts with the electronic component
Implementation Method 2
A plurality of fins are mounted on the cover opposite to the base
Implementation Method 3
A plurality of fins are mounted on the cover opposite to the base
Implementation Method 4
utilizing cooled water to transfer heat from electronic components to fins and then to the water
Data Source
AI summary
A heat dissipation device includes a heat absorbing member, a number of fins mounted on the heat absorbing member, a first connecting pipe, and a second connecting pipe. A top surface of the heat absorbing member defines a serpentine slot. The slot includes an inlet hole and an outlet hole communicating with two opposite ends of the slot and extending through the heat absorbing member. The first connecting pipe is connected to the inlet hole of the heat absorbing member, and the second pipe is connected to the outlet hole of the heat absorbing member.