Liquid-Cooled Integrated Cabinet for High-Density Server Heat Dissipation
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Solution Overview
Problem
Current air-cooled server cabinets face limitations in power density, high energy consumption, significant noise, and large space occupation due to their design, which struggles to efficiently manage high heat generation in environments like bitcoin mining operations.
Innovation Solution
A liquid-cooled integrated cabinet design where cooling liquid flows through a cold plate shell inside the module, directly contacting and dissipating heat from computing power modules, reducing the need for air compression and enhancing energy efficiency, with a heat dissipation capacity of up to 80 KW per cabinet.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air-cooled server cabinets are used, then the cabinet can operate with simple cooling structure, but the power density is low (maximum 20 KW) and heat dissipation efficiency is insufficient
Solution Approach 1:
The patent applies hydraulic cooling by circulating liquid coolant through cold plate heat exchangers installed on computing power modules. The liquid cooling system absorbs heat more efficiently than air cooling, enabling the cabinet to handle up to 80 KW of heat dissipation while maintaining a compact structure without requiring complex air compression equipment.
2Reliability
If air compression and high-power fans are used for cooling, then the cabinet can maintain operational temperature, but the energy consumption is high and power density is limited
Solution Approach 1:
The patent replaces energy-intensive air compression systems with a liquid circulation cooling system. The liquid coolant absorbs heat directly from computing power modules through cold plates and is cooled by heat exchangers, eliminating the need for high-power fans and air compressors while maintaining reliable temperature control.
Solution Approach 2:
The patent substitutes mechanical air cooling systems (fans and compressors) with a liquid-based thermal conduction and convection system. The liquid cooling system transfers heat more efficiently with minimal energy input, replacing the mechanical air movement system that consumed excessive energy.
3Productivity
If high-power fans are used to drive air flow through the cabinet, then heat dissipation is achieved, but the noise level is large
Solution Approach 1:
The patent uses liquid circulation instead of high-speed air flow to achieve heat dissipation. The liquid coolant moves through cold plates and heat exchangers with minimal turbulence, producing negligible noise compared to high-power fans, while maintaining effective heat transfer from computing power modules.
4Reliability
If a single air-cooled cabinet is equipped with inter-row air-conditioner cabinet, then the cooling requirement can be met, but the area occupied is large
Solution Approach 1:
The patent integrates the cooling system directly within the cabinet structure by installing cold plate heat exchangers on computing power modules and incorporating liquid circulation piping within the cabinet. This eliminates the need for separate inter-row air-conditioner cabinets, reducing the total space required while maintaining adequate cooling capability for up to 80 KW heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The liquid-cooled system significantly improves heat dissipation efficiency, reduces noise by minimizing the role of cooling fans, and allows for more compact and maintainable designs, while preventing pipeline freezing with temperature-resistant cooling mediums.
Implementation Method 1
a cold plate shell in the liquid-cooled module contacts and conducts heat with a chip in the computing power module
Implementation Method 2
cooling liquid flows through a cold plate shell inside the liquid-cooled module
Data Source
AI summary
The present invention provides a liquid-cooled integrated cabinet, which belongs to the technical field of servers, and comprises a main body. A power distribution module is provided at the upper end of the main body, and multiple computing power modules which constitute a computing power center are parallelly provided on one side of the lower end of the main body; cooling fans stacked on top and bottom in multiple layers are arranged on the other side thereof; the computing power module is cooled by a liquid-cooled module, and the liquid-cooled module is a front and rear drawing structure relative to the main body. The cooling fan bears 8%-12% of the heat dissipation capacity. A cold plate shell in the liquid-cooled module contacts and conducts heat with a chip in the computing power module. The front end of the main body is provided with a hose for cooling medium to circulate; a liquid-cooled module corresponds to a hose; cooling medium flows through the hose and the liquid-cooled module, and then cools down the computing power module. The liquid-cooled integrated cabinet of the present invention is high in heat dissipation efficiency and compact in structure.