Orthogonal Midplane Cooling via Top-Mounted Plenum Fans
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Solution Overview
Problem
The orthogonal mid-plane configuration in cooling systems poses challenges in cooling horizontal cards, especially when front-to-back air flow is required, as conventional cooling methods often result in limited airflow and reduced available PCB area due to fan placement.
Innovation Solution
Incorporating an air-permeable barrier within a plenum on the side of the apparatus, with fans or blowers positioned to create a pressure difference and direct airflow across horizontal modules, enhancing airflow uniformity and efficiency while maintaining front-to-back air flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fans or blowers are placed along the sides of horizontal cards to create air pressure, then cooling capability is improved, but PCB area and panel surface are severely limited
Solution Approach 1:
The invention moves the fan assembly from a side-mounted position (one-dimensional placement along the card edge) to a top-mounted position above the horizontal cards (two-dimensional placement in the vertical dimension). This dimensional change allows fans to be positioned in the plenum space above the cards rather than along their sides, thereby creating air pressure without encroaching on PCB or panel surface area.
Solution Approach 2:
The invention introduces a plenum as an intermediary chamber between the fans and the horizontal cards. The plenum serves as a mediator that distributes the air pressure generated by the fans uniformly across multiple cards simultaneously. This intermediary structure allows a single fan assembly to cool multiple cards without requiring individual fan placements on each card, thus preserving PCB and panel surface area.
2Ease of operation
If air is diverted from front intake to back and run up a column next to horizontal cards, then front-to-back air flow is maintained, but air flow amount is limited due to number of turns in air path
Solution Approach 1:
The invention segments the cooling system into distinct functional zones: a plenum chamber for air distribution, horizontal card mounting areas, and separate air intake/exhaust paths. By segmenting the air flow path and using the plenum as a distribution hub, the system can maintain front-to-back air flow while providing direct, short air paths to each card, thereby increasing overall air flow amount despite multiple turns in the main circulation path.
Solution Approach 2:
The plenum acts as an intermediary chamber that receives air from the front intake and distributes it directly to the horizontal cards before air is exhausted to the back. This intermediary plenum space allows air to be pressurized and distributed efficiently to multiple cards simultaneously, maintaining front-to-back air flow while significantly increasing the total air flow amount compared to direct column routing.
3Temperature
If conventional cooling mechanisms are used for vertical cards with front air intake and rear air exhaust, then cooling is achieved, but horizontal cards cannot be cooled while maintaining overall front-to-back air flow
Solution Approach 1:
The invention creates a universal cooling plenum structure that serves multiple functions: it distributes air to vertical cards through side plenums while simultaneously distributing pressurized air to horizontal cards through top-mounted fan assemblies. This multi-functional plenum design allows the same basic cooling architecture to accommodate both vertical and horizontal card orientations, thereby achieving versatility in cooling capability while maintaining front-to-back air flow.
Solution Approach 2:
The cooling system is segmented into separate air distribution pathways within the plenum: one pathway for vertical cards (maintaining conventional front-to-back flow) and another pathway for horizontal cards (with top-mounted fans providing direct air pressure). This segmentation allows each card type to receive optimized cooling independently while both contribute to the overall front-to-back air flow pattern.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves more uniform and effective airflow across the surface area of horizontal modules, improving cooling efficiency and maintaining the integrity of the PCB area by optimizing airflow paths and fan placement.
Implementation Method 1
fans or blowers positioned to create a pressure difference and direct airflow across horizontal modules
Data Source
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AI summary
A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. Each set of modules is independently cooled. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exhausts from a back of the apparatus. A horizontal set of modules is cooled with horizontal front-to-back air flow. When the horizontal set of modules is at the front of the apparatus, a plenum extending exterior to the vertical set of modules allows exhausting horizontally flowing air to the rear of the apparatus. When the horizontal set of modules is at the rear of the apparatus, a plenum extending exterior to the vertical set of modules allows moving air from the front of the apparatus to a chamber holding the horizontal modules.