Insulating Gas Cooling Loop for HVDC Converters
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Solution Overview
Problem
Conventional cooling methods for high-voltage electrical components, such as HVDC converters, face challenges with water leakage and diffusion in insulating gas environments, leading to material compatibility issues and inefficient cooling in compact designs.
Innovation Solution
A cooling system utilizing low-temperature insulation gas in its liquid state as both coolant and insulating medium, where the gas is liquefied and circulated through heat-exchanging elements to absorb thermal power, evaporating and discharging vapor to cool electrical components, thereby avoiding water leakage and providing efficient, compact cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional water cooling is used for electrical components, then sufficient cooling capacity is achieved, but material compatibility issues arise due to water leakage and diffusion in insulating gas environments
Solution Approach 1:
The patent merges the cooling function and insulation function into a single system by using the insulating gas (SF6) itself as the coolant. The closed-loop cooling system circulates the insulating gas through heat exchangers to remove heat from electrical components, while the gas maintains its insulating properties in the enclosure. This eliminates the need for separate water cooling systems and avoids water leakage issues entirely.
Solution Approach 2:
The insulating gas serves multiple functions simultaneously: it provides electrical insulation in the high-voltage enclosure and acts as the cooling medium in the closed-loop system. This multi-functionality resolves the contradiction by using a single substance for both insulation and cooling, eliminating material compatibility conflicts between water and insulating gas.
2Volume of moving object
If electrical components are packed more closely to reduce footprint, then space efficiency improves, but heat-generating components generate higher heat density requiring alternative cooling concepts
Solution Approach 1:
The patent employs a closed-loop gas cooling system that uses pressurized insulating gas as the coolant. The gas is circulated through heat exchangers in direct thermal contact with electrical components, providing efficient heat removal from high-density packed components. The pneumatic circulation system enables effective cooling of compact arrangements without requiring additional space for separate cooling infrastructure.
3Temperature
If convective or forced gas cooling is used, then cooling is provided, but voluminous flows and bulky connections are required
Solution Approach 1:
The patent changes the state parameter of the insulating gas from gaseous to liquid phase in the heat exchangers to enhance cooling efficiency. By liquefying the SF6 gas through compression and heat exchange, the system achieves superior heat transfer coefficients without requiring voluminous flows or bulky connections. The phase change enables compact heat exchanger design while maintaining effective cooling of high-density electrical components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively minimizes material compatibility issues, allows for compact and efficient cooling, and reduces the risk of contamination by using a single medium for both insulation and cooling, while maintaining moderate pressure and reducing component resistivity.
Implementation Method 1
at least one condenser configured to condense said medium from a gaseous state to a liquid state
Implementation Method 2
The liquid medium is then transported to the heat-exchanging element(s) where it evaporates and depressurizes, absorbing thermal power corresponding to the rate of change in its temperature and latent heat
Implementation Method 3
The at least one heat-exchanging element is configured for thermal contact with the at least one electrical element for cooling the at least one electrical element by said medium
Implementation Method 4
at least one circulation means configured to circulate the medium from the at least one condenser to the at least one heat-exchanging element, and to circulate the medium discharged from the at least one heat-exchanging element back to the at least one condenser
Data Source
Figure 1
Figure 2
AI summary
A cooling arrangement (100) for at least one electrical element for electrical conversion, comprising an electrically insulating medium (200) for insulation of the at least one electrical element, at least one condenser (300) configured to condense the medium from a gaseous state to a liquid state, at least one heat-exchanging element (600) fluidly connected to the at least one condenser and configured for thermal contact with the at least one electrical element for cooling the at least one electrical element by the medium, wherein the at least one heat-exchanging element is configured to evaporate the medium from a liquid state during cooling of the at least one electrical element and to discharge the evaporated medium, and at least one circulation means (700) configured to circulate the medium from the condenser(s) to the heat-exchanging element(s), and to circulate the medium discharged from the heat-exchanging element(s) back to the condenser(s).