Power Module Cooling via Vertical Pin Turbulent Flow
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Solution Overview
Problem
Conventional cooling apparatuses for power modules have low cooling efficiency due to simple tube or pin structures, which affects the overall energy efficiency and durability of electric vehicles.
Innovation Solution
A cooling apparatus that vertically sprays a cooling fluid on a heat-generated surface through micropins on a pin plate configured perpendicular to the manifold cover, creating a vertical turbulent flow to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a simple tube structure or pin structure is used in the conventional cooling apparatus, then the device complexity is reduced, but the cooling efficiency deteriorates
Solution Approach 1:
The cooling apparatus is divided into multiple cooling modules, each with independent cooling channels and pin structures. This segmentation allows each module to independently cool specific regions of the power module, improving overall cooling efficiency while maintaining manageable structural complexity
Solution Approach 2:
The patent introduces vertical pins extending from the pin plate to create three-dimensional cooling channels. This dimensional change transforms the conventional two-dimensional tube structure into a three-dimensional cooling network, significantly enhancing heat dissipation capability without proportionally increasing structural complexity
2Reliability
If cooling efficiency is increased through advanced cooling structures, then the durability and performance maintenance of power modules is improved, but the device complexity increases
Solution Approach 1:
The manifold cover and pin plate are merged into an integrated cooling module assembly. The manifold cover contains cooling channels that connect to pins on the pin plate, forming a unified cooling system that improves durability through combined structural support while managing complexity through functional integration
Solution Approach 2:
The cooling apparatus is designed to directly contact both surfaces of the power module, allowing the cooling structure to serve its own support function while providing cooling. The rigid cooling modules provide both thermal management and mechanical support, reducing the need for separate structural components
3Reliability
If a vertical turbulent flow is created through micropins, then the heat-dissipation performance is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The pins are pre-positioned on the pin plate in predetermined patterns and orientations. This preliminary arrangement of pins before final assembly ensures proper alignment for creating vertical turbulent flow, reducing the precision requirements during final assembly while maintaining the desired flow characteristics
Solution Approach 2:
The patent optimizes parameters such as pin diameter, pin spacing, and pin length to achieve effective turbulent flow cooling with reasonable manufacturing tolerances. By carefully selecting these parameters, the system achieves high heat-dissipation performance without requiring extreme manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves improved heat-dissipation performance without the need for separate nozzle spray systems, thereby increasing the cooling efficiency and extending the lifespan of power modules.
Implementation Method 1
cooling the heat-generated surface
Implementation Method 2
cooling fluid to be introduced into the first channel flows in the second direction and then flows out through the second channel
Implementation Method 3
cause the vertical turbulent flow of the cooling fluid
Data Source
AI summary
A cooling apparatus for a power module including a plurality of cooling modules provided to be in contact with each of both surfaces of the power module, in which the cooling module includes a manifold cover provided with a plurality of guide walls extending in a first direction in a state of being spaced apart from each other and a pin plate having one surface being in contact with the power module and having a plurality of pins extending in a second direction crossing the first direction formed on the other surface thereof.