Vertical Component Heat Dissipation with Thermal Resin
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Solution Overview
Problem
Existing heat dissipation techniques are inadequate for components mounted vertically or with complex shapes on electronic circuit boards, as they often rely on inefficient methods such as heat sinks with fins, thermal pastes, or moving parts like fans, which fail to effectively manage heat in varying temperature applications.
Innovation Solution
A heat dissipation device comprising a hollow cylindrical or prismatic body made of a copper-beryllium alloy, filled with a high thermal conductivity resin, featuring flexible tabs for contact with a main heat sink, and an optional intermediate insulating element to ensure secure and efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks with fins are used for heat dissipation, then heat dissipation capability is improved, but the device becomes unsuitable for vertically mounted or complex-shaped components
Solution Approach 1:
The invention changes the geometric parameters of the heat dissipation device from traditional finned structures to a cylindrical body with radial fins, allowing adaptation to vertically mounted components. The resin material also changes the thermal conduction parameter from surface contact to volumetric contact, improving heat dissipation for complex-shaped components.
Solution Approach 2:
The invention uses a composite structure combining a metallic cylindrical body with radial fins and a thermally conductive resin material. This composite approach allows the device to adapt to various component shapes and mounting configurations while maintaining effective heat dissipation through both conduction and convection mechanisms.
2Temperature
If thermal paste is used to ensure optimum contact, then thermal conductivity is improved, but the technique is poorly suited for vertically mounted or complex-shaped components
Solution Approach 1:
The invention uses a liquid resin material that can flow and conform to the component's shape, similar to hydraulic principles where a fluid adapts to the container. This allows the resin to completely surround vertically mounted or complex-shaped components, ensuring maximum thermal contact without requiring precise mechanical fitting like traditional thermal paste.
3Temperature
If fans are used for cooling, then cooling efficiency is improved, but the system requires moving parts, power consumption, and produces noise
Solution Approach 1:
The heat dissipation device performs self-service by using passive convection currents generated by the temperature difference itself. The radial fins naturally create air circulation patterns that draw heat away from the component without requiring external power sources or moving parts, eliminating the need for fans while maintaining effective cooling.
4Temperature
If Peltier effect cooling devices are used, then cooling efficiency is improved and moving parts are eliminated, but condensation issues arise and they are only suitable for specific components like microprocessors
Solution Approach 1:
The invention uses a simple, inexpensive resin material that can be easily applied and replaced if needed, rather than complex Peltier devices. This approach prioritizes simplicity and versatility over maximum cooling efficiency, making it suitable for a wide range of components rather than just high-power microprocessors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective heat dissipation for a wide range of components, including vertically mounted or complex-shaped ones, with enhanced mechanical shock and vibration immunity, easy dismantling, and adaptability to existing electronic components, while maintaining efficient thermal conductivity and electrical insulation.
Implementation Method 1
a resin made of a second material, having a thermal conductivity greater than 1 W.m -1
Implementation Method 2
the heat dissipation device is a hollow body, of straight cylindrical or prismatic shape, made of a first material
Implementation Method 3
the useful volume of the cylindrical body including at least the component, the device heat dissipation contains a resin
Data Source
Figure 1~3
AI summary
The invention relates to a heat dissipation device (1) for a component mounted on an electronic circuit board (20), including: a hollow body having a cylindrical or right-angled prismatic shape, consisting of a first material arranged vertically above the electronic circuit board (20), the useful volume of the body including at least the component, and a resin consisting of a second material, at least partially filling the inner volume of the body so as to contain the component. The heat dissipation device can be arranged on an intermediate insulating element (22), and the resin can be introduced in the liquid state.