Conductive-Particle Display Module Bonding Without Exposure or Deposition

The patent extracts and eliminates the complex exposure and deposition processes from the manufacturing flow, replacing them with a simpler wire bonding or conductive paste application method. This removes unnecessary process steps while maintaining electrode connection precision through direct bonding approaches.

The patent replaces the photochemical exposure and thermal deposition processes with mechanical bonding methods such as wire bonding or direct paste application followed by reflow soldering. This substitution simplifies the manufacturing system while achieving reliable electrical connections.

The patent removes the expensive exposure and deposition equipment and processes from the manufacturing line, replacing them with lower-cost wire bonding or paste application methods. This extraction of unnecessary processes directly reduces capital equipment investment and operational manufacturing costs.

The patent employs simpler, less expensive bonding materials and methods that can be applied directly without requiring expensive photoresist materials and specialized deposition equipment. This approach uses more economical materials and processes to achieve the same connection function.

The patent replaces the multi-step exposure and deposition process with a direct mechanical bonding approach using wire bonding or paste application. This simplified mechanical process reduces the number of handling steps and thermal cycles, thereby minimizing chip shift and void formation while maintaining connection reliability.

The patent performs preliminary positioning and alignment of the light emitting diode chip with the electrode pattern before bonding, ensuring precise placement. This preliminary action prevents misalignment and reduces the risk of chip shift during the bonding process, while the subsequent direct bonding method prevents void formation by avoiding complex process steps.