Display Pad Opening Layout for Conductive Ball Chip Bonding
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Solution Overview
Problem
Existing display devices face challenges in achieving reliable electrical connections between pad electrodes and driving chips, leading to defects where the two components are not properly connected.
Innovation Solution
The display device incorporates a substrate with a pad area, a pad electrode with a first conductive pattern, a driving chip overlapping the pad electrode, an insulating layer defining openings exposing the conductive pattern, and an adhesive member with conductive balls arranged in a specific pattern to enhance contact frequency between the conductive balls and the pad electrode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional adhesive member with conductive balls is used to connect the pad electrode and driving chip, then the electrical connection is established, but defects occur where the pad electrode and driving chip are not properly connected
Solution Approach 1:
The insulating layer is configured with different regions having different properties: a first region with a first opening for electrical connection and a second region with a second opening for adhesive material penetration. This local differentiation allows the same layer to serve multiple functions - enabling both reliable electrical connection through the first opening and strong mechanical bonding through the second opening, thereby resolving the contradiction between connection reliability and manufacturing defect rate
Solution Approach 2:
The connection structure is segmented into distinct functional zones: the first opening dedicated to electrical conduction path and the second opening dedicated to adhesive bonding path. This segmentation allows each opening to be optimized for its specific function without interfering with the other, ensuring both reliable electrical connection and proper mechanical attachment while reducing manufacturing defects
2Reliability
If the opening in the insulating layer is made larger to expose more conductive pattern, then the electrical connection is improved, but the adhesive material cannot properly bond the components
Solution Approach 1:
The insulating layer is configured with different regions having different properties: a first region with a first opening for electrical connection and a second region with a second opening for adhesive material penetration. This local differentiation allows the same layer to serve multiple functions - enabling both reliable electrical connection through the first opening and strong mechanical bonding through the second opening, thereby resolving the contradiction between connection reliability and manufacturing defect rate
Solution Approach 2:
The connection structure is segmented into distinct functional zones: the first opening dedicated to electrical conduction path and the second opening dedicated to adhesive bonding path. This segmentation allows each opening to be optimized for its specific function without interfering with the other, ensuring both reliable electrical connection and proper mechanical attachment while reducing manufacturing defects
Data Source
AI summary
A display device includes a substrate including a display area, and a pad area at one side of the display area, a pad electrode above the substrate in the pad area, and including a first conductive pattern, a driving chip above the substrate in the pad area, and overlapping the pad electrode in plan view, an insulating layer above the substrate, and defining an opening exposing a portion of the first conductive pattern, and an adhesive member connecting the pad electrode and the driving chip, and including conductive balls repeatedly arranged along a first direction, wherein the opening includes first openings spaced apart from each other in the first direction, and having a first width in a second direction crossing the first direction that is substantially equal to a diameter of the conductive balls, and second openings respectively connecting adjacent ones of the first openings.