Multi-Layered Pad Structure for Display Device Corrosion Resistance
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Solution Overview
Problem
During the manufacturing of display devices, exposed pads are prone to corrosion, leading to reduced electrical resistance, which affects the overall performance and reliability of the device.
Innovation Solution
A display device with pads having a multi-layered structure, including a metal layer, a conductive protective layer, and a metal thin film, where the metal thin film improves etching speed and contributes to a forward-tapered lateral surface, minimizing the number of manufacturing processes while maintaining electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If exposed pads are used in display device manufacturing, then electrical connection is achieved, but corrosion occurs leading to reduced electrical resistance
Solution Approach 1:
The pad structure uses a composite multi-layer configuration consisting of a metal layer (e.g., Al, Cu, or Mo), a conductive protective layer (e.g., ITO, IZO, or AZO), and optionally a metal thin film layer. This composite structure combines the high conductivity of metal with the corrosion resistance and protective properties of transparent conductive oxides, preventing pad corrosion while maintaining electrical connection reliability.
Solution Approach 2:
The conductive protective layer is applied in advance to the metal layer before the pad is exposed for electrical connection. This preliminary protective coating prevents corrosion from occurring during subsequent manufacturing processes and device operation, addressing the corrosion issue before it can affect the pad's electrical characteristics.
2Reliability
If multiple protective layers are added to pads, then corrosion resistance improves, but manufacturing process complexity increases
Solution Approach 1:
The pad structure is integrated with the existing display device manufacturing process by combining the formation of the metal layer, conductive protective layer, and metal thin film layer into a unified multi-layer structure that is processed together. This merging approach allows the protective layers to be formed using existing sputtering or atomic layer deposition (ALD) equipment and processes already used for other device components, avoiding the need for separate dedicated processing steps.
3Reliability
If a multi-layered pad structure is used, then electrical characteristics are maintained, but the number of manufacturing processes increases
Solution Approach 1:
The metal layer, conductive protective layer, and metal thin film layer are formed together in advance as an integrated multi-layer structure before the pad exposure step. This preliminary formation of the complete pad structure eliminates the need for separate deposition steps later in the process, maintaining electrical characteristics while improving manufacturing efficiency by consolidating processes.
Data Source
AI summary
A display device includes: a substrate including a display area and a peripheral area outside the display area; a plurality of display elements arranged in the display area; and a pad disposed in the peripheral area and having a multi-layered structure, where the multi-layered structure of the pad includes: a metal layer; a conductive protective layer on a top surface of the metal layer; and a metal thin film on a top surface of the conductive protective layer.