Display Substrate Pad Bending Structure to Block Crack Propagation
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Solution Overview
Problem
In full-screen bezel-free display panels, the bending of the non-display portion to the back leads to breakage of metal wires due to the cracking of integrated inorganic insulating layers, causing display failure as cracks propagate to surrounding metal wires.
Innovation Solution
A display substrate with a pad bending region featuring a flexible base, discrete metal wires, and discrete first inorganic insulating layers arranged between the metal wires and the base, where the inorganic insulating layer covers the metal wires and has a thickness of 500 Å to 2500 Å, preventing crack propagation by removing the inorganic insulating layer from external regions and using an organic insulating layer to protect metal wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an integrated inorganic insulating layer is used to cover metal wires in the pad bending region, then insulating performance is improved, but the layer cracks during bending causing metal wire breakage
Solution Approach 1:
The integrated inorganic insulating layer is divided into discrete first inorganic insulating layers, each covering individual metal wires. This segmentation allows each small insulating layer to bend independently without cracking, while still providing effective insulation for its corresponding metal wire.
Solution Approach 2:
The inorganic insulating layer is selectively applied only in regions where metal wires are located, rather than forming a continuous layer across the entire pad bending region. This local application reduces overall brittleness while maintaining insulating performance where needed.
2Reliability
If the inorganic insulating layer is removed from external regions to prevent crack propagation, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The insulating layer structure is segmented into discrete portions under each metal wire, eliminating the need for a continuous inorganic layer in external regions. This segmentation inherently prevents crack propagation while simplifying the manufacturing process compared to selective removal techniques.
Solution Approach 2:
The inorganic insulating layer is extracted or removed from external regions where it is not needed for insulation, leaving only the essential portions under metal wires. This reduces the overall inorganic layer content that could propagate cracks while maintaining necessary insulating functions.
Data Source
AI summary
Provided is a display substrate, a method for preparing the same, and a display device. The display substrate includes a pad bending region. In the pad bending region, the display substrate includes a base, and an inorganic insulating layer and a metal layer laminated on the base. The metal layer includes a plurality of discrete metal wires. The inorganic insulating layer includes a plurality of discrete first inorganic insulating layers, each of which is arranged between each of the plurality of discrete metal wires and the base.