Display Pad Insulating Structure for Etch-Resistant Signal Line Contacts
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Solution Overview
Problem
Existing electronic apparatuses face failures due to the exposure of signal lines and conductive patterns during the fabrication process, leading to short circuits and deterioration of pads connected to the circuit substrate.
Innovation Solution
The electronic apparatus is designed with a specific structure where the maximum thickness of the pad insulating layer is greater than the sum of the first and second insulating layers, and the pads are formed with a conductive pattern that penetrates through multiple insulating layers to prevent exposure and chemical reactions, thereby reducing the risk of failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the pad insulating layer thickness is increased to protect the signal line end portion from etching solutions, then the reliability of the pad connection is improved, but the device complexity and fabrication process difficulty increase
Solution Approach 1:
The insulating layer structure is segmented into multiple functional layers: a first insulating layer covering circuit elements, a second insulating layer covering the first conductive layer, and a pad insulating layer with maximum thickness greater than the sum of the first and second insulating layer thicknesses. This segmentation allows each layer to serve specific protective functions, with the pad insulating layer specifically designed to protect the signal line end portion from etching solutions during fabrication.
Solution Approach 2:
The pad insulating layer is formed in advance with a maximum thickness greater than the sum of the first and second insulating layer thicknesses before the etching process. This preliminary action ensures that the signal line end portion is already protected by sufficient insulating material before etching solutions are applied, preventing chemical reactions and potential short circuits that would occur without this advance protection.
2Manufacturing precision
If the pad insulating layer thickness is increased to prevent exposure of the signal line end portion, then the manufacturing precision is improved, but the fabrication time and productivity are reduced
Solution Approach 1:
The fabrication process merges multiple functions into the pad insulating layer formation step. By forming the pad insulating layer with maximum thickness greater than the sum of the first and second insulating layer thicknesses in a single process step, the patent simultaneously achieves protection of the signal line end portion, prevention of pad exposure, and establishment of proper electrical isolation, thereby improving manufacturing precision without requiring multiple separate fabrication steps.
Data Source
AI summary
A method of fabricating an electronic apparatus including the steps of forming a circuit element on a base substrate, forming a signal line on the base substrate, forming a first insulating layer covering the circuit element and the signal line, forming a display device layer including a light-emitting device on the first insulating layer, forming a first conductive layer on the display device layer, forming a second insulating layer covering the first insulating layer and the first conductive layer, forming a first contact hole penetrating the first and second insulating layers in a first region overlapping with the first conductive layer, forming a second contact hole penetrating the first and second insulating layers in a second region overlapping with an end portion of the signal line, forming a second conductive layer overlapping with the first region, and forming a pad overlapping with the second region.