Display Panel Bonding Pads With Protrusions for Misalignment Tolerance
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Solution Overview
Problem
Existing display devices face challenges in minimizing contact resistance between the display panel and the driver circuit, leading to reduced electrical connectivity and reliability, especially when misalignment occurs.
Innovation Solution
Incorporation of protruding patterns of varying sizes and thicknesses between the display panel substrate and the pad connecting to the driver circuit, with the first protruding pattern having a smaller area but greater thickness than the second, ensuring stable electrical contact and reduced signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional flat bonding structure is used between the display panel and driver circuit, then the manufacturing process is simple, but the contact resistance increases and electrical connectivity deteriorates when misalignment occurs
Solution Approach 1:
The patent employs protruding patterns with curved surfaces instead of flat bonding interfaces. The protruding patterns extend from the display panel substrate toward the driver circuit, creating a curved contact surface that naturally accommodates misalignment and maintains reliable electrical connectivity even when bonding surfaces are not perfectly parallel.
Solution Approach 2:
The patent transitions from a two-dimensional flat bonding interface to a three-dimensional protruding structure. By adding vertical dimensionality with protruding patterns of varying heights and areas, the bonding structure gains the ability to compensate for misalignment in multiple directions while maintaining contact pressure and electrical connectivity.
2Strength
If uniform protruding patterns are used, then the manufacturing process is simpler, but the contact pressure distribution is uneven and adhesion is suboptimal
Solution Approach 1:
The patent implements protruding patterns with non-uniform characteristics, where each protruding pattern has a specific area and height tailored to its location. This local differentiation optimizes contact pressure distribution across the bonding interface, enhancing adhesion strength in critical areas while maintaining manufacturability through systematic variation rather than complete uniformity.
3Reliability
If the bonding surfaces are not perfectly parallel, then manufacturing alignment is more tolerant, but the contact area decreases and contact resistance increases
Solution Approach 1:
The patent incorporates protruding patterns that anticipate and compensate for potential misalignment before bonding occurs. The protruding structures extend beyond the flat substrate surface, creating a buffer zone that maintains contact pressure and electrical connectivity even when the bonding surfaces are not perfectly parallel, thereby cushioning against alignment errors.
Data Source
AI summary
A display device including: a display panel; a driver circuit connected to a pad of the display panel; and a first protruding pattern and a second protruding pattern disposed between a substrate of the display panel and the pad and protruding toward a terminal of the driver circuit, wherein an area of the first protruding pattern is less than an area of the second protruding pattern, and a thickness of the first protruding pattern is greater than a thickness of the second protruding pattern.