Display Pad Connector Layout to Prevent Conductive Particle Shorts
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Solution Overview
Problem
Display devices often experience short circuits between circuit pads or driving pads due to improper alignment of conductive particles, leading to inefficiencies in bonding processes and increased risk of electrical failures.
Innovation Solution
The use of conductive particles aligned on circuit pads or driving pads with a conductive adhesive member, ensuring precise alignment through affinity properties like hydrophilicity, and the inclusion of a filling agent to prevent overlap and enhance bonding efficiency between the circuit board and display panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive particles are used to bond circuit pads and driving pads, then electrical connection is achieved, but short circuits may occur between pads
Solution Approach 1:
The patent applies preliminary action by pre-aligning conductive particles to circuit pads before bonding occurs. The conductive particles are positioned in advance on the circuit board pads, ensuring they will bond only to corresponding driving pads during the subsequent bonding process, thereby preventing short circuits between adjacent pads
Solution Approach 2:
The patent uses an insulating layer as an intermediary between adjacent circuit pads and driving pads. This insulating layer acts as a barrier that prevents conductive particles from bridging between adjacent pads, thereby eliminating the short circuit risk while maintaining electrical connection reliability
2Productivity
If conductive adhesive member is applied broadly to ensure bonding coverage, then bonding efficiency improves, but conductive particles may overlap between pads causing short circuits
Solution Approach 1:
The patent applies local quality by creating localized bonding areas where conductive particles are specifically aligned to individual circuit pads. The insulating layer creates distinct bonding zones, ensuring particles bond only to their intended targets rather than spreading broadly, thus maintaining both bonding efficiency and alignment precision
Solution Approach 2:
The conductive particles are preliminarily positioned on the circuit board pads before the bonding process. This pre-alignment ensures that during bonding, particles are already in the correct locations and will only attach to corresponding driving pads, preventing overlap between pads while maintaining efficient bonding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the likelihood of short circuits and improves the bonding process by ensuring conductive particles do not overlap spaces between pads, thereby enhancing the electrical connection and reliability of display devices.
Implementation Method 1
ensuring precise alignment through affinity properties like hydrophilicity
Data Source
AI summary
The invention relates to display device and method of manufacturing the same. The display device includes: a substrate; a driving pad disposed on the substrate; an insulating layer exposing the driving pad and disposed on the substrate; a circuit board including a circuit pad overlapping the driving pad; and a connector disposed between the circuit board and the insulating layer and including a plurality of conductive particles electrically connecting the driving pad and the circuit pad, the driving pad including: a first pad disposed on the substrate; and a second pad disposed on the first pad and having an opening exposing the first pad.