Perpendicular Electrode Pads for Short-Safe Chip Placement
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Solution Overview
Problem
The increasing miniaturization of micro-semiconductor chips and the expansion of display devices pose challenges for the pick and place method, leading to decreased productivity and potential electrical short-circuits due to the difficulty in accurately transferring and positioning these chips without causing unintentional contact between electrodes.
Innovation Solution
A display device with a perpendicular electrode structure is designed, featuring a first pad connected to the first electrode and a second pad connected to the second electrode, where the second electrode is not in contact with the first pad when the micro-semiconductor chip is absent, and a dummy pad is used to prevent short-circuiting, with the first pad having specific shapes and recesses to avoid overlap with the second electrode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If the pick and place method is used to transfer micro-semiconductor chips, then the transfer process can be automated, but productivity decreases due to the difficulty in accurately positioning miniaturized chips and the risk of unintentional electrode contact
Solution Approach 1:
The invention divides the electrode structure into multiple segments: first electrode extending in a first direction, second electrode extending in a second direction perpendicular to the first direction, third electrode extending in the first direction, and fourth electrode extending in the second direction. This segmentation creates isolated electrode regions that reduce the risk of short-circuits during chip transfer while maintaining automated pick and place operations.
Solution Approach 2:
The invention transitions from a planar electrode layout to a multi-dimensional perpendicular electrode structure. The first and third electrodes extend in the first direction while the second and fourth electrodes extend in the second direction perpendicular to the first direction, creating a spatial arrangement that prevents unintentional contact during chip positioning.
2Manufacturing precision
If micro-semiconductor chips are miniaturized to increase display resolution, then display quality improves, but the risk of unintentional electrode contact increases due to reduced positioning margin
Solution Approach 1:
The electrode structure is segmented into four separate electrodes (first, second, third, and fourth electrodes) arranged in perpendicular directions. This segmentation isolates the electrical contacts, ensuring that even with miniaturized chips, only the intended electrodes make contact during transfer, preventing short-circuits while maintaining high display resolution.
Solution Approach 2:
The invention applies different spatial arrangements to different electrode regions. The first and third electrodes are positioned to contact the chip at specific locations, while the second and fourth electrodes are positioned in perpendicular directions to provide additional isolation. This localized electrode arrangement ensures reliable electrical contact only at intended positions.
3Reliability
If the electrode structure is designed to ensure contact with micro-semiconductor chips, then electrical connection reliability improves, but the risk of short-circuit increases when chips are absent or mispositioned
Solution Approach 1:
The electrode structure is divided into four separate segments extending in perpendicular directions. This segmentation ensures that when a micro-semiconductor chip is present, it contacts only the intended electrodes for proper electrical connection. When chips are absent or mispositioned, the segmented structure prevents unintended contact between electrodes, eliminating short-circuit risks.
Solution Approach 2:
The perpendicular arrangement of electrodes acts as an intermediary spatial structure that mediates between the need for reliable electrical contact and the need to prevent short-circuits. The specific geometric arrangement ensures that electrode contact occurs only through the intended chip interface, not through direct electrode-to-electrode contact.
Data Source
AI summary
A display device having a perpendicular electrode structure and a method of manufacturing the display device are provided. The display device includes a display substrate including wiring therein, a first pad provided on the display substrate and connected to the wiring, a second pad provided on the display substrate, spaced apart from the first pad, and connected to the wiring, and a micro-semiconductor chip including a first electrode, a p-type semiconductor layer provided on the first electrode, an active layer provided on the p-type semiconductor layer, an n-type semiconductor layer provided on the active layer, and a second electrode provided on the n-type semiconductor layer, wherein the micro-semiconductor chip is constituted by a perpendicular electrode chip, the first electrode is connected to the first pad, and the second electrode is connected to the second pad.