Display Panel Backside Bonding Layout for Full-Screen Splicing
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Solution Overview
Problem
Current display panels cannot achieve a full screen design due to the presence of lower frames, which are necessary to accommodate bonding conductive layers and prevent bending marks and protection marks from forming.
Innovation Solution
A display panel design where a second substrate is added to one side of the first substrate, with conductive holes in the vacant areas of the pixel units allowing electrical connection between the pixel driving circuit and the bonding conductive layer, eliminating the need for a lower frame and enabling full-screen functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If bonding areas are bent to the back of display panels to reduce bottom frames, then bottom frames can be reduced, but bending marks and protection marks for side traces are created, making lower frames indispensable
Solution Approach 1:
The patent moves the bonding conductive layer from the traditional planar position at the bottom of the display panel to a vertical position on the back surface. By utilizing the third dimension (depth/vertical space) rather than expanding the bottom frame horizontally, the bonding function is achieved without creating bending marks or requiring lower frames, thus resolving the contradiction between frame reduction and avoiding harmful bending marks.
2Object-affected harmful factors
If lower frames are kept to avoid bending marks, then protection marks are prevented, but full screen design cannot be achieved
Solution Approach 1:
The patent relocates the bonding conductive layer to the back surface of the display panel, utilizing vertical space instead of horizontal expansion. This dimensional shift allows the display area to extend to the edges (full screen) while the bonding function is maintained on the back surface, eliminating the need for lower frames that would obstruct the full screen design.
3Reliability
If bonding conductive layer is placed on the first substrate, then electrical connection is achieved, but lower frame is required which prevents full screen
Solution Approach 1:
The patent separates the display function (on the front surface of the first substrate) from the bonding function (on the back surface of the first substrate or second substrate). This segmentation allows each function to be optimized independently: the front surface achieves full screen display while the back surface accommodates the bonding conductive layer, maintaining electrical connection without requiring lower frames.
Solution Approach 2:
The bonding conductive layer is relocated from the front plane to the back surface, utilizing the third dimension. This allows electrical connections to be established without occupying the display area on the front surface, enabling full screen design while maintaining reliable electrical connectivity through the conductive holes and bonding layer on the back surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for complete elimination of the lower frame, enhancing the display panel's ability to achieve a full screen while preventing mechanical processing-induced cracks from reaching the light-emitting area, thus improving the display's aesthetic and operational integrity.
Implementation Method 1
the conductive hole is filled with a conductive adhesive; and a bonding conductive layer is disposed on the second substrate, and the pixel driving circuit is electrically connected to the bonding conductive layer through the conductive hole
Data Source
AI summary
A display panel and a splicing screen are provided. The display panel includes a first substrate and a second substrate. The pixel unit on the first substrate includes a light-emitting area and a vacant area. The light-emitting area is provided with a light-emitting diode chip and a pixel driving circuit. At least one conductive hole is provided in the vacant area. The second substrate is arranged on a side of the first substrate facing away from the pixel unit, and the pixel driving circuit is electrically connected to a bonding conductive layer included in the second substrate through the conductive hole, which can eliminate a lower frame of the first substrate and prevent crack extension.