LED Display Panel Buffer Grooves for Safer Micro-LED Transfer
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Solution Overview
Problem
The challenge lies in safely transferring small-sized LEDs onto a circuit board for display applications without causing defects, such as cracks, and in optimizing the sub-pixel area to enhance brightness, as conventional methods face difficulties in mounting and replacing individual LEDs due to their small size and the impact of laser lift-off techniques.
Innovation Solution
A display panel design featuring a circuit board with pads and a buffer material layer, including conductive particles and a light blocking material layer, which facilitates the safe transfer of LEDs by mitigating the impact of laser lift-off and increasing the sub-pixel area, allowing for efficient electrical connection and improved light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser lift-off technique is used to separate LEDs from growth substrate, then transfer efficiency is improved, but defects such as cracks occur in LEDs due to laser impact
Solution Approach 1:
A buffer material layer is introduced as an intermediary between the circuit board and the LEDs during the transfer process. This buffer layer absorbs and distributes the laser impact energy, preventing direct transmission of harmful laser forces to the LEDs while still enabling effective laser lift-off separation from the growth substrate.
Solution Approach 2:
The buffer material layer is pre-positioned on the circuit board before the LED transfer process. This cushioning layer is specifically designed to mitigate the harmful effects of laser impact before the LEDs are separated from the growth substrate, thereby preventing cracks and defects in advance.
2Productivity
If sub-pixel area is reduced to fit more sub-pixels in restricted area, then pixel density is improved, but luminous area is reduced and brightness deteriorates
Solution Approach 1:
The invention transitions from a two-dimensional arrangement of sub-pixels on the circuit board surface to a three-dimensional structure by stacking multiple LED layers vertically. This allows each sub-pixel to maintain adequate luminous area while achieving high pixel density through vertical integration of red, green, and blue LED layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the safe and efficient transfer of LEDs onto a circuit board, reducing defects and enhancing the brightness of sub-pixels by optimizing the sub-pixel area, thereby improving the overall display quality.
Implementation Method 1
a buffer material layer, which facilitates the safe transfer of LEDs by mitigating the impact of laser lift-off
Implementation Method 2
A display panel design featuring a circuit board with pads and a buffer material layer, including conductive particles
Implementation Method 3
and a light blocking material layer, which facilitates the safe transfer of LEDs by mitigating the impact of laser lift-off and increasing the sub-pixel area
Data Source
AI summary
A display panel including a circuit board having pads, light emitting devices electrically connected to the pads and arranged on the circuit board, each light emitting device having a first surface facing the circuit board and a second surface opposite to the first surface, a buffer material layer disposed between the circuit board and the light emitting devices to fill a space between the circuit board and the light emitting devices, and a cover layer covering the second surface of the light emitting devices, in which the buffer material layer is disposed under the first surfaces of the light emitting devices and has grooves in a region between adjacent light emitting devices, a portion of a top surface of the buffer material layer is disposed between adjacent light emitting devices, and the cover layer fills the grooves of the buffer material layer.