Display Panel Circuit Structure Repair via Buried Metal Layer
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Solution Overview
Problem
Conventional display devices often experience metal layer disconnections during manufacturing, leading to faulty transistors and storage capacitors, which disrupts the operation of serially connected logic circuits and affects display quality and product yield, increasing manufacturing costs.
Innovation Solution
A display panel circuit structure with a buried third metal layer that can replace broken metal layers, ensuring continuous operation by maintaining electrical connectivity through a welding process between the second and third metal layers when the second metal layer is disconnected.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal layers are connected in conventional display devices, then electrical connectivity is achieved, but metal layer disconnections occur during manufacturing leading to circuit failures
Solution Approach 1:
The patent applies preliminary action by pre-configuring a replacement metal layer structure before manufacturing defects occur. The second metal layer is designed with a wider pad area that can accommodate potential disconnections, and the third metal layer is positioned ready to serve as a backup connection path. This preventive structure allows the circuit to maintain functionality even when manufacturing variations cause disconnections in the primary metal layer.
Solution Approach 2:
The patent implements beforehand cushioning by creating a redundant metal layer architecture where the third metal layer serves as a backup pathway. When the second metal layer experiences disconnection during manufacturing, the third metal layer provides an alternative conduction path, cushioning the system against the harmful effect of manufacturing imprecision and preventing circuit failure.
2Productivity
If serially connected logic circuits are used, then logic functions are performed, but circuit failures due to metal layer disconnections disrupt operation and reduce product yield
Solution Approach 1:
The patent applies parameter changes by modifying the geometric parameters of the metal layers. The second metal layer has a non-uniform width with a wider pad area and a narrower trace area. This parameter variation increases the probability of successful electrical connection at the pad region while maintaining circuit functionality, thereby improving both reliability and product yield without changing the fundamental circuit architecture.
3Ease of manufacture
If metal layer disconnections are not repaired, then manufacturing process is simple, but transistors and storage capacitors cannot operate correctly increasing manufacturing costs
Solution Approach 1:
The patent implements preliminary action by pre-establishing the third metal layer as a replacement pathway during the manufacturing process. This eliminates the need for complex post-manufacturing repair operations, as the repair capability is built into the structure itself. The manufacturing process remains relatively simple while gaining inherent repairability through the redundant metal layer configuration.
Data Source
AI summary
A display panel circuit structure includes a substrate, a first metal layer, a second metal layer, and a third metal layer. The first metal layer is disposed on the substrate. The second metal layer is disposed on the first metal layer and electrically connected to the first metal layer, in which the second metal layer has a pad area and a trace area connected to the pad area. The line width of the second metal layer in the pad area is greater than the line width of the second metal layer in the trace area. The third metal layer is disposed on the second metal layer, in which the third metal layer does not overlap the second metal layer n the trace area.