Display Panel COF Bonding with Blocking Structures
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Solution Overview
Problem
The existing chip-on-film (COF) packaging technology in display devices faces challenges with high contact impedance and adjacent circuit connections, leading to increased bezel width and bonding difficulties, which necessitates a solution to reduce on-resistance and prevent metal material overflow into the display area.
Innovation Solution
The implementation of a display panel design with conductive and non-conductive regions, where the COF is electrically connected via a printed circuit with additional contacts and blocking structures to prevent adjacent circuit connections and metal overflow, enhancing the stability and yield of the display panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If lateral-side bonding is used to attach COF to reduce peripheral area, then the bezel width is reduced, but the contact impedance between COF and bonding region increases
Solution Approach 1:
The patent transitions from a single-plane bonding interface to a three-dimensional structure by adding blocking structures that extend vertically from the substrate. This dimensional change creates multiple bonding contact points and increases the effective bonding area, thereby reducing contact impedance while maintaining the narrow bezel design.
Solution Approach 2:
The blocking structures serve as intermediary elements between the COF and the substrate. These structures provide additional contact points and improve the bonding interface, acting as a mediator that reduces contact impedance without requiring an increase in peripheral area.
2Reliability
If spacing between conductive regions is increased to prevent adjacent circuit connections, then connection reliability improves, but the width of COF becomes larger and bonding difficulty increases
Solution Approach 1:
The patent divides the bonding interface into multiple segmented contact regions by introducing blocking structures. This segmentation allows for better control of the bonding process, improving connection reliability while maintaining a compact COF width that is easier to bond.
Solution Approach 2:
The blocking structures create local quality variations in the bonding interface, with enhanced contact properties at specific locations. This localized improvement in bonding quality ensures reliable connections without requiring increased spacing between conductive regions, thereby maintaining ease of manufacture.
3Area of stationary object
If COF is bonded to lateral side of display panel, then peripheral area is reduced, but adjacent printed circuits may connect to each other
Solution Approach 1:
The blocking structures act as intermediary barriers between adjacent printed circuits. These structures physically separate the circuits while allowing the COF to maintain its narrow width, thereby preventing unintended connections without increasing the peripheral area.
Solution Approach 2:
The blocking structures are designed to preemptively prevent adjacent printed circuits from connecting. By placing these structures in advance during the bonding process, the patent eliminates the risk of circuit shorting before it can occur, ensuring reliable circuit isolation in the compact lateral-side bonding configuration.
Data Source
AI summary
A display panel includes an array substrate, a counter substrate, and at least one chip-on-film (COF), each COF is electrically connected to the conductive region via a printed circuit. The conductive region and the printed circuit corresponding to the conductive region include a first contact and a second contact. Besides, the array substrate is provided with a first blocking structure and a second blocking structure.