Printed Circuit Aspects TRIZ Cases

Segmented thin copper foil and composite layers resolve weight and cost trade-offs while enabling dual-side processing.

A printed circuit board uses a resist layer protrusion to define pad spacing and prevent solder ball misalignment.

A printed circuit board stack structure uses overflow grooves and retaining walls to contain filling glue between bonded layers.

A countersink replacement structure electrically couples to a via through its stem portion.

A dielectric resonator uses a metal layer on an encirclement wall to isolate the cavity area from external space.

Spring biasing eliminates air gaps between the PCB and flange, resolving reliability issues from mechanical wear.

Flip chip optoelectronic assembly reduces inductance and enhances heat dissipation by mounting components face down on the PCB.

A piezoelectric sound generator integrates directly onto a circuit board surface using lead lines and soldering parts to connect electrodes.

A heat conductive structure transfers thermal energy from a flexible circuit to an outer frame within a display device assembly.

A vertical antenna structure with a base and support portion sits on the substrate to enable compact electronic package encapsulation.

A PCB adapter uses spring-loaded connectors to attach to battery terminals on populated circuit boards.

Elastic latching assemblies secure printed circuit boards on carriers, eliminating manual glue application and improving heat dissipation efficiency.

Optimizing the opening depth between 3 μm and 18 μm prevents solder ball deformation and ensures reliable electrical connections.

A memory card substrate integrates a switch guide unit with a slot, encapsulated by a molding member to form the writing permitting element.

Integrated battery and heat-radiating sheet enable independent operation and shock resistance by merging power supply with thermal management.

A resin composition uses magnesium oxide particles with a specific particle size distribution to improve heat dissipation in printed circuit boards.

A flexible circuit sheet maintains electrical connectivity during bending, enabling accurate tracking of the distal tip without straining lead wires.

Standby bonding pads on the substrate allow immediate reconnection to alternate pads, eliminating solder splash cleaning and reducing wire-bonding time.

A printed wiring board via with a tapered inner wall ensures sufficient plated film thickness at the conductor interface.

A modified silicone compound reacts with maleimide and acidic amines to form a thermosetting resin composition for printed wiring boards.

Alternating display, touch, and fingerprint pads in the bonding area reduces wiring length to shrink the non-display border width.

Fluorinated self-assembled monolayer enables direct electroless metal patterning, eliminating chemical etch processes that increase surface roughness.

A printed circuit board incorporates a glass layer with a cavity and protruding through-vias to fill the space, controlling warpage in large-area structures.

A circuit board integrates phase change materials within a nested heat conductive substrate to manage thermal energy.

A printed circuit board combines point-to-point and daisy-chain channel topologies to support flexible memory configurations.

Vertical stiffener portions cover exposed glass core edges to prevent micro-cracks and defects during singulation, boosting manufacturing yield.

Folded radiation plates and a resonant feed circuit improve signal directivity despite small antenna coil sizes.

Limiting liquid crystal polymer crystal orientation below 0.3 reduces dielectric constant and loss variations across the base member.

A ceramic circuit board uses aluminum nitride with copper-filled vias and screen-printed conductor tracks.

Vertical PCB stacking minimizes volume while preventing optical interference between sensors.

Sintered vias connect PCB layers to embed components, eliminating costly electroplating and reducing yield loss.

Blocking structures in the display panel reduce contact impedance and prevent adjacent circuit connections for narrower bezels.

A resin composition using a prepolymerized divinylbenzene, allyl, and acrylate blend with DOPO flame retardants.

Segmented insulation layers maintain 3000 V dielectric strength while ultrathin films reduce carrier thickness below 500 μm.

An orthogonal wire harness routed through a dedicated cover resolves assembly complexity while maintaining electromagnetic interference shielding.

Chemical bonding between metal oxide and graphene oxide layers enhances rigidity, reducing delamination in miniaturized power inductors.

Alternating high and low current density cycles during direct current electroplating inhibit void formation in thick substrates.

Heat sinks mounted on both faces dissipate core thermal energy, resolving inadequate cooling for high-power semiconductor packages.

A recess-and-projection design on insulating layer side surfaces increases exposed area to enhance heat dissipation in laminated electronic components.

Spring tangs on the metallic shell abut plug bull-nose tips to eliminate separate shielding plates and reduce assembly complexity.

Grooves at rigid-flex boundaries disperse stress to prevent conductor breakage during bending cycles.

A 16-channel neurotrophic electrode array uses a fan-shaped substrate to detect neural signals with high precision.

An integrated miniature welding plate structure connects scattered wires to pads via conductive layers, ensuring stable electrical contact.

High thermal diffusivity materials in the device housing resolve overheating risks while a control circuit regulates power to prevent eye exposure.

A heat radiation layer on a flexible printed circuit board thermally connects to drive circuitry to dissipate generated heat.

A wiring board recess with a central raised portion guides conductor film deposition, preventing void formation and ensuring stable electrical connections.

Segmenting the PCB with isolation grooves blocks thermal conduction from CPUs to protect vehicle-mounted SIM cards from distortion.

Flexible substrates mount flash memory chips to increase storage capacity while maintaining a compact device size.

Separately controlled plates adjust height to compensate for substrate warpage, ensuring precise conductive ball placement and reducing attachment defects.

Embedding the precision resistor reduces installation space and vibration sensitivity while maintaining measurement accuracy.