Temporary Carrier for Coreless Substrate Manufacturing
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Solution Overview
Problem
Existing methods for manufacturing coreless substrates face challenges such as high cost, low yield rate, difficult operation, limited layer building up to single sides, and low output rate, due to the use of thick metal carriers which are heavy, prone to defects, and costly.
Innovation Solution
A temporary carrier comprising a core layer with double Cu foils on both sides, where the outer layer Cu foil is narrower than the inner layer Cu foil, and an etching resisting layer is applied to seal the gap between the Cu foils, allowing for simultaneous layer building up on both sides and easy removal of the temporary carrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a thick metal carrier (0.2-0.3mm) is used as temporary carrier, then supporting strength is improved, but weight increases making it difficult for workers to carry and apparatus to transport
Solution Approach 1:
The patent divides the temporary carrier into multiple layers: a thin metal carrier (1-3μm Cu foil) for minimal weight, a core layer (0.06-0.1mm) for structural support, and a reinforcing layer (0.03-0.06mm Cu clad laminate) for enhanced strength. This segmentation allows achieving required supporting strength without using a single thick metal carrier, thereby reducing weight for easier handling and transportation.
Solution Approach 2:
The patent employs composite material structure combining thin Cu foil, core layer, and Cu clad laminate with different thicknesses and properties. The Cu clad laminate serves as both core and reinforcing layer, providing optimal combination of strength and weight reduction. This composite approach resolves the contradiction between needing sufficient supporting strength and minimizing weight for worker carrying and apparatus transportation.
2Strength
If a thick metal carrier (0.2-0.3mm) is used as temporary carrier, then supporting strength is improved, but cost increases
Solution Approach 1:
The patent segments the carrier structure into thin metal layers (1-3μm Cu foil) and thinner core layers (0.06-0.1mm), replacing the conventional thick metal carrier (0.2-0.3mm). This segmentation significantly reduces material consumption and manufacturing cost while maintaining supporting strength through the composite structure with Cu clad laminate reinforcing layer, making the process more cost-effective.
Solution Approach 2:
The patent uses a thin, disposable temporary carrier structure that is discarded after serving its purpose of enabling early layer building up operations. The thin Cu foil (1-3μm) combined with core layer creates a cost-effective temporary carrier that fulfills its function without the high material cost of thick metal carriers (0.2-0.3mm), aligning with the principle of using inexpensive disposable objects when appropriate.
3Ease of manufacture
If etching method is used to remove metal carrier, then carrier removal is achieved, but etching liquid penetrates through defects to damage circuit layer or Cu column layer
Solution Approach 1:
The patent changes the thickness parameter of the metal carrier from conventional 0.2-0.3mm to a thin layer of 1-3μm Cu foil. This parameter change ensures that during etching process, the etching liquid cannot penetrate through the thin carrier to reach and damage the circuit layer or Cu column layer, as the thin carrier is completely removed without leaving defects. The etching amount required (0.01-0.03mm) is controlled to match the thin carrier thickness, preventing over-etching and damage to underlying structures.
Solution Approach 2:
The patent performs preliminary action by building up the substrate layers to sufficient thickness (0.08-0.1mm) on the thin temporary carrier before removal. This preliminary layer building up creates a protective structure that further prevents etching liquid penetration during carrier removal, ensuring circuit layer integrity while enabling complete carrier removal through controlled etching.
4Strength
If thick metal carrier (0.2-0.3mm) is used, then supporting strength is improved, but operation difficulty increases due to heavy weight
Solution Approach 1:
The patent segments the carrier into thin Cu foil (1-3μm), core layer (0.06-0.1mm), and Cu clad laminate reinforcing layer (0.03-0.06mm). This segmentation achieves supporting strength through the composite structure while minimizing the weight of the metal carrier component, making the overall temporary carrier lightweight and easy for workers to handle and for apparatus to transport, resolving the operation difficulty issue.
Solution Approach 2:
The composite material structure combining thin Cu foil with core layer and Cu clad laminate provides optimal strength-to-weight ratio. The thin Cu foil (1-3μm) contributes minimal weight while the composite structure maintains supporting strength, significantly improving ease of operation compared to thick metal carriers (0.2-0.3mm), enabling easy worker carrying and apparatus capturing and transportation.
5Productivity
If conventional temporary carrier is used, then layer building up can be performed, but only on single side limiting productivity
Solution Approach 1:
The patent designs the temporary carrier with thin Cu foil (1-3μm) on both sides of the core layer, enabling the carrier to serve as a universal substrate for simultaneous layer building up operations on both sides of the substrate. This multi-functionality allows doubling the output rate compared to single-sided processing, significantly improving productivity while the simple thin-layer structure maintains ease of handling and processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces processing costs, increases yield rate, simplifies operations, enables simultaneous processing on both sides, and minimizes defects by using a lightweight, easy-to-handle temporary carrier that can be efficiently separated and removed.
Implementation Method 1
an etching resisting layer is applied to seal the gap between the Cu foils, allowing for simultaneous layer building up on both sides and easy removal of the temporary carrier
Data Source
AI summary
A temporary carrier according to an embodiment of the present invention may include a core layer, a first Cu foil layer and a second Cu foil layer on surfaces of both sides of the core layer. Each of the first Cu foil layer and the second Cu foil layer may include double Cu foils which are physically attached together.