PCB Isolation Grooves for SIM Card Thermal Protection
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Solution Overview
Problem
In vehicle-mounted terminal devices, the SIM card is prone to distortion or damage due to high temperatures caused by heat dissipation from components like the CPU on the circuit board, as existing heat management solutions are inadequate.
Innovation Solution
A chip heat dissipation structure featuring a chip card holder molded into a printed circuit board with isolation grooves that separate the chip card holder from other heat-generating components, reducing heat transfer and preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the SIM card is fixed on the circuit board through a card holder in existing vehicle-mounted terminals, then the SIM card can be securely mounted and electrically connected, but the SIM card is easily distorted or damaged due to high temperature caused by CPU heat dissipation and other heat-generating components
Solution Approach 1:
The circuit board is segmented into different thermal zones by introducing isolation grooves that physically divide the board into a heat dissipation area (containing CPU and other heat-generating components) and a heat isolation area (containing the SIM card holder). This segmentation prevents heat transfer from the CPU area to the SIM card area, protecting the SIM card from thermal damage while maintaining secure mounting and electrical connection.
Solution Approach 2:
The isolation groove acts as a thermal barrier or intermediary element between the heat-generating CPU area and the SIM card holder area. This intermediary structure blocks the thermal conduction path, allowing the SIM card to remain electrically connected to the circuit board while preventing direct heat transfer from nearby components.
2Object-affected harmful factors
If heat isolation measures are implemented for the SIM card, then heat exposure to the SIM card is reduced, but the structural complexity of the circuit board increases
Solution Approach 1:
The circuit board is segmented into different thermal zones by introducing isolation grooves that physically divide the board into a heat dissipation area (containing CPU and other heat-generating components) and a heat isolation area (containing the SIM card holder). This segmentation prevents heat transfer from the CPU area to the SIM card area, protecting the SIM card from thermal damage while maintaining secure mounting and electrical connection.
Solution Approach 2:
The isolation groove is implemented as a thin structural feature (effectively a 'thin film' barrier) that provides thermal isolation without adding significant structural complexity. The groove can be integrated into the circuit board manufacturing process, creating a simple yet effective thermal barrier that does not require complex additional components or assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces heat transfer to the chip card holder, preventing distortion and damage, while maintaining electrical connectivity and ensuring signal quality and stability.
Implementation Method 1
the at least one isolation groove is configured to isolate an area in which the chip card holder is located from another area on the PCB
Data Source
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AI summary
The present invention provides a chip heat dissipation structure, where the chip heat dissipation structure is disposed on a printed circuit board (PCB), where the chip heat dissipation structure includes a chip card holder and at least one isolation groove; the chip card holder and the PCB are molded into one body; and the at least one isolation groove is disposed on the PCB and located around the chip card holder, and the at least one isolation groove is configured to isolate an area in which the chip card holder is located from another area on the PCB. The present invention further provides a terminal device.