Reinforced Electronic Component for Stress-Resistant System-in-Package
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Solution Overview
Problem
Electronic components, particularly miniaturized power inductors, are vulnerable to external stress and thermal impacts due to reduced size, leading to defects like delamination and cracking, and system-in-packages face reliability issues with reduced module area and complex designs.
Innovation Solution
An electronic component with a reinforcing layer comprising a metal oxide layer and a graphene oxide layer, forming chemical or covalent bonds with the body, is used to enhance rigidity and mechanical stability, and a system-in-package design that includes this component with an encapsulant forming bonds with the reinforcing layers to improve structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the coil is reduced to miniaturize the power inductor, then the volume of the body region is reduced, but the inductor becomes vulnerable to external stress or thermal impacts
Solution Approach 1:
The patent applies composite materials by forming a chemical bond between the metal oxide layer and the body, creating a reinforced structure. This composite approach enhances the mechanical strength and stress resistance of the miniaturized inductor body without increasing its volume, directly resolving the contradiction between miniaturization and reliability.
2Area of stationary object
If several chips are packaged simultaneously in a system-in-package, then the module area is reduced and added value is increased, but the design complexity of the mounting substrate increases
Solution Approach 1:
The patent applies segmentation by dividing the mounting substrate into a body region and a pad region, with the coil structure specifically configured in the body region. This segmented design simplifies the overall substrate layout for system-in-package applications, reducing design complexity while maintaining compact module area.
3Volume of moving object
If the volume of the central portion of the core is reduced, then the inductor is miniaturized, but it becomes more susceptible to thermal impacts
Solution Approach 1:
The patent applies composite materials by creating a chemically bonded metal oxide layer on the body surface. This composite structure provides thermal stability and protection against thermal impacts, allowing the inductor to be miniaturized without increasing susceptibility to thermal damage.
4Strength
If a reinforcing layer with metal oxide and graphene oxide is added, then rigidity characteristics are improved and defects are reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies composite materials by forming a multi-layer structure with metal oxide layer and graphene oxide layer that are chemically bonded to the body. This composite reinforcing layer significantly improves rigidity and reduces defects while the chemical bonding process integrates seamlessly with existing manufacturing workflows.
Solution Approach 2:
The patent applies parameter changes by controlling the thickness of the reinforcing layer to be the same as or less than the thickness of the external electrode. This parameter optimization ensures improved rigidity while maintaining manufacturing feasibility and avoiding excessive process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces defects such as delamination and cracking, enhancing the reliability of electronic components and system-in-packages by improving mechanical stability and stress resistance, as demonstrated by reduced stress-induced failures in comparative examples.
Implementation Method 1
a material constituting the metal oxide layer and a material constituting the body may form a chemical bond therebetween
Implementation Method 2
The material constituting the metal oxide layer and the material constituting the body may form a covalent bond therebetween
Implementation Method 3
The metal oxide layer and the graphene oxide layer may form a chemical bond therebetween
Implementation Method 4
The metal oxide layer and the graphene oxide layer may form a covalent bond therebetween
Data Source
AI summary
An electronic component includes: a body having electrical insulating properties; an external electrode disposed on an external surface of the body; and a reinforcing layer disposed on a surface of the body and including a metal oxide layer and a graphene oxide layer.