Circuit Board Phase Change Heat Dissipation Structure
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Solution Overview
Problem
Circuit boards face performance and lifespan issues due to inadequate heat dissipation from electronic components, which can lead to thermal management challenges.
Innovation Solution
The implementation of a circuit board design that incorporates phase change materials and a heat conductive structure, including metal layers with receiving grooves and blind holes, to enhance heat dissipation. This design involves pressing together substrates with phase change layers and connecting posts to form a heat conductive layer, which is then wrapped around the phase change structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat dissipation structures are used, then the circuit board can maintain simple structure, but the heat dissipation performance is insufficient leading to high temperature of electronic components
Solution Approach 1:
The patent implements a nested heat dissipation structure where the heat conductive layer is embedded within the substrate, and the phase change material is positioned in receiving grooves and blind holes of the metal layer. This nested arrangement allows multiple heat dissipation functions to be integrated without significantly increasing external dimensions, resolving the contradiction between improved heat dissipation performance and structural simplicity.
Solution Approach 2:
The patent combines multiple materials with different thermal properties: high-thermal-conductivity metal layers (copper or aluminum), phase change materials (paraffin, inorganic salt hydrate, or fatty acid), and dielectric layers. This composite material structure enables superior heat dissipation performance while maintaining reasonable structural complexity through functional integration.
2Temperature
If phase change materials and heat conductive structures are added, then heat dissipation performance is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent incorporates receiving grooves and blind holes into the metal layer during the manufacturing process, and pre-positions the phase change material in these structures before final assembly. This preliminary preparation of heat dissipation structures during standard manufacturing steps reduces the need for additional complex processing, thereby improving ease of manufacture while maintaining enhanced heat dissipation performance.
3Reliability
If heat dissipation structures are implemented, then safety performance and service life are improved, but the circuit board thickness increases
Solution Approach 1:
The heat conductive layer and phase change material are nested within the substrate and metal layer structures, utilizing existing spatial volumes rather than adding external layers. This nested configuration improves reliability through enhanced heat dissipation while minimizing increases in overall circuit board thickness.
Solution Approach 2:
The phase change material is strategically positioned in specific receiving grooves and blind holes where heat generation is most intense, rather than uniformly distributing heat dissipation structures throughout the entire circuit board. This localized approach enhances safety performance and service life at critical hot spots while minimizing overall thickness increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively reduces the temperature of electronic components by absorbing heat through phase change materials, thereby improving the safety performance and service life of circuit boards while also reducing their overall thickness.
Implementation Method 1
absorbing heat through phase change materials
Implementation Method 2
heat conductive structure, including metal layers with receiving grooves and blind holes
Data Source
AI summary
A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.