Optical Module Assembly Flip Chip PCB Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional optoelectronic assemblies face challenges with high frequency transmission due to high resistance wire-bonds, inefficient heat dissipation, and hindered inspection and repair due to the active component and IC being face-up on the printed circuit board.
Innovation Solution
The optoelectronic assembly employs flip chip technology for connecting active components and ICs on a printed circuit board, with a lens module and fiber assembly on the lower surface for optical coupling, allowing for improved heat dissipation and easier inspection and repair.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire-bond technology is used to connect active component and IC, then electrical connection is achieved, but inductance is high which is not fit for high frequency transmission
Solution Approach 1:
The patent extracts and eliminates the wire-bond connection structure from the system. Instead of using wire-bonds to connect the active component and IC, the invention directly integrates these components onto the PCB, removing the intermediate wire-bond element that causes high inductance and is unsuitable for high frequency transmission.
Solution Approach 2:
The patent merges the active component, IC, and PCB into a more integrated structure. By directly mounting both components on the PCB and eliminating separate wire-bond connections, the invention combines multiple elements into a unified assembly that reduces inductance and improves high frequency performance.
2Ease of manufacture
If active component and IC are mounted face up on PCB, then electrical connection is simplified, but heat dissipation efficiency is compromised
Solution Approach 1:
The patent transitions from a two-dimensional face-up mounting arrangement to a three-dimensional configuration where components are mounted face down. This dimensional change allows the heat dissipation surfaces of both the active component and IC to contact the PCB directly, improving thermal management while maintaining manufacturing simplicity.
Solution Approach 2:
Instead of mounting the active component and IC face up as in conventional designs, the patent inverts the mounting orientation to face down. This inversion allows the heat dissipation surfaces to directly contact the PCB, fundamentally improving heat dissipation efficiency while maintaining ease of manufacture.
3Ease of manufacture
If active component and IC are mounted face up, then assembly is simplified, but inspection and repair of VCSEL becomes hindered
Solution Approach 1:
The patent uses vertical space above the PCB to position the lens module, separating it from the face-down mounted active component. This three-dimensional arrangement allows the lens to be accessible for inspection and repair from above, while the active component remains optimally positioned for heat dissipation and electrical connection.
Solution Approach 2:
The patent segments the optical function (lens module) from the electrical component (active component and IC). By separating these functions into distinct modules with different spatial arrangements, the invention allows the lens to be accessible for inspection and repair while the active component maintains optimal mounting for performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces inductance, enhances heat dissipation, and facilitates inspection and repair by enabling optical coupling and efficient electrical signal transmission while maintaining high frequency capabilities.
Implementation Method 1
a lens module located on the side of the lower surface and communicating with the active component through via holes in the PCB, and a fiber assembly located in the lens module to be optically coupled to the active component
Data Source
AI summary
An optoelectronic assembly includes a printed circuit board (PCB) defining opposite upper and lower surfaces, and equipped, on the upper surface, with an active component and an Integrated Circuit (IC) linked to each other via the flip chip technology, a lens module located on the side of the lower surface and communicating with the active component through via holes in the PCB, and a fiber assembly located in the lens module to be optically coupled to the active component via said lens module.