Electronic Component Side Surface Recess and Projection for Heat Dissipation

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Solution Overview

Problem

Existing electronic components with alternately laminated conductive and insulating layers face challenges in heat dissipation from the side surface and dicing difficulties, especially when the number of insulating layers is large or the thickness is substantial.

Innovation Solution

The electronic component features a recess-and-projection shape on the side surfaces of the insulating layers to increase the exposed area for improved heat dissipation, and a manufacturing method that involves forming sacrificial patterns to facilitate dicing by creating spaces between components, allowing for efficient individualization even with multiple insulating layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the aggregate substrate is subjected to dicing for individualization, then many electronic components can be obtained, but the side surface of the electronic component becomes flattened which deteriorates heat dissipation from the side surface

Engineering Contradiction:

Improvenumber of electronic components obtainedVSAvoidheat dissipation from side surface

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The insulating layers are divided into multiple sections along the thickness direction, with recessed parts and projecting parts creating segmented surfaces. This segmentation increases the side surface area for heat dissipation while maintaining the ability to dice multiple components from an aggregate substrate

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention adds vertical dimensionality to heat dissipation by creating recessed and projecting parts on the side surfaces of insulating layers. This transforms the previously flat two-dimensional side surface into a three-dimensional structure with increased surface area, enabling heat dissipation in additional spatial dimensions

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Device complexity

If the number of insulating layers is large or the thickness of the insulating layer is large, then the electronic component structure becomes more complex, but it becomes difficult to dice the aggregate substrate

Engineering Contradiction:

Improvenumber of insulating layersVSAvoiddicing of aggregate substrate

Core Design Contradiction:

Device complexityVSEase of manufacture

Solution Approach 1:

Sacrificial patterns are formed within the insulating layers before the lamination process. These sacrificial patterns create predetermined spaces that serve as pre-defined dicing paths, making the subsequent dicing process easier even when numerous insulating layers are present

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Sacrificial patterns act as intermediary structures during manufacturing. These temporary structures are embedded within the insulating layers to facilitate the dicing process, and are subsequently removed to create clean separation spaces between individual electronic components

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS11452209B2Electronic component and its manufacturing method

Publication Date: 2022.09.20 TDK CORP

AI summary

Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.