Multilayer Component Carrier for LED Heat Dissipation
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Solution Overview
Problem
High-power chip carriers, such as those used in high-brightness LED systems, face challenges in thermal management and electrical insulation, requiring materials with high thermal conductivity and thin profiles to efficiently dissipate heat while maintaining dielectric strength.
Innovation Solution
A multilayer carrier body with a structured functional region, utilizing stacked films with high thermal conductivity materials like copper and ceramic substrates, forming an integrated heat sink for efficient heat dissipation and incorporating ultrathin protective components for electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the carrier thickness is reduced to less than 500 μm to position the heat source near the heat sink, then heat dissipation efficiency is improved, but electrical insulation between heat source and heat sink becomes more difficult to maintain at 3000 V dielectric strength
Solution Approach 1:
The carrier is divided into multiple functional layers including a substrate, a functional region with heat dissipation structures, and an insulation layer. This segmentation allows each layer to specialize in its function: the substrate provides mechanical support, the functional region maximizes heat transfer to the heat sink, and the insulation layer ensures electrical isolation between the heat source (LED) and heat sink, resolving the contradiction between thin profile and electrical insulation.
Solution Approach 2:
An insulation layer is introduced as an intermediary element between the heat source and heat sink. This intermediate layer provides the necessary electrical insulation (3000 V dielectric strength) while allowing thermal conduction to occur, thus enabling both close positioning for heat dissipation and adequate electrical isolation.
2Temperature
If high thermal conductivity materials are used to improve heat dissipation, then thermal management is enhanced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The functional region is designed with localized heat dissipation structures (such as heat spreaders or thermal vias) that concentrate high thermal conductivity material where it is most needed - directly between the heat source and heat sink. The substrate material can vary in composition to provide optimal thermal pathways, while other regions use standard materials, thus improving thermal management without uniformly increasing complexity throughout the entire device.
Solution Approach 2:
The carrier employs composite material construction combining different materials with complementary properties: ceramic or metal substrates for mechanical strength and thermal conduction, insulation layers for electrical isolation, and functional region materials optimized for heat transfer. This composite approach allows tailored thermal management performance while maintaining manufacturability through established multi-material fabrication techniques.
3Length of stationary object
If ultrathin protective components are integrated to maintain thin carrier profile, then heat dissipation efficiency is improved, but electrical insulation and protection capabilities may be compromised
Solution Approach 1:
Ultrathin protective components and insulation layers are implemented as thin-film structures that provide adequate electrical protection and insulation despite their minimal thickness. These thin films maintain the carrier's slim profile (less than 500 μm) while delivering necessary protective functions through optimized material selection and layer design that maximizes protection-to-thickness ratio.
Solution Approach 2:
Protective components are constructed using composite material systems that deliver high dielectric strength and protection capabilities in ultrathin form factors. By combining multiple materials with complementary properties in a layered composite structure, the design achieves both thin profile and reliable protection functionality simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective heat dissipation and integration of thin protective components, enhancing thermal management and electrical insulation in high-power chip carriers, ensuring efficient power utilization and prolonged LED system lifespan.
Implementation Method 1
The multilayer carrier body has a stacked construction since it is constructed from a multiplicity of films which were stacked to form a stack and which were subsequently consolidated, for example, by sintering to form the carrier body.
Implementation Method 2
The dissipation of heat from the heat source, which can be an LED, for example, to the housing can take place via thermal heat sinks running vertically and/or horizontally in the substrate in the form of a thermally optimized block
Data Source
AI summary
A component carrier includes a multi-layer carrier body having a substrate containing a structured functional. The substrate extends both laterally and also at least partially above and below the functional region. Alternatively, or in addition, the substrate extends both laterally and also completely above and/or below the functional region. Alternatively, or in addition, the substrate or a further region is arranged in or extends into the functional region.