Heat Radiation Layer on FPC for Display Driver IC Thermal Management

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Solution Overview

Problem

As display devices increase in size and resolution, the heat generation in driver ICs becomes a significant issue due to the increased current flow, leading to potential temperature rises that can affect performance and reliability.

Innovation Solution

The implementation of a heat radiation layer on a flexible printed circuit board (FPC) thermally connected to the drive circuitry, which diffuses and radiates heat away from the driving IC chip, thereby suppressing temperature rises.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the display device is enlarged in size and resolution is enhanced, then the display quality and functionality are improved, but the heat generation in driver ICs increases

Engineering Contradiction:

ImproveresolutionVSAvoidheat generation

Core Design Contradiction:

Measurement precisionVSTemperature

Solution Approach 1:

The patent extracts the heat radiation function from the standard FPC structure by adding a dedicated heat radiation layer. This layer is specifically designed to absorb and dissipate heat generated by the driver IC, separating the thermal management function from the electrical connection function of the FPC.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The heat radiation layer acts as an intermediary between the driver IC and the external environment. It receives heat from the driver IC through thermal conduction and dissipates it to the surrounding air through convection and radiation, preventing direct heat transfer to sensitive display components.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Measurement precision

If the number of pixels is increased to enhance resolution, then the display quality is improved, but the current flow and heat generation in driver ICs increase

Engineering Contradiction:

ImproveresolutionVSAvoidheat generation

Core Design Contradiction:

Measurement precisionVSLoss of energy

Solution Approach 1:

The patent converts the harmful heat energy generated by the driver IC into a manageable thermal field. The heat radiation layer absorbs this waste heat and redistributes it across a larger area, transforming concentrated harmful heat into dispersed acceptable warmth that does not affect display performance.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent addresses the two-dimensional heat concentration problem by introducing a third dimension - the heat radiation layer extends the thermal dissipation path from a point source (driver IC) to a planar structure (FPC with heat radiation layer), increasing the surface area for heat dissipation and reducing thermal density.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If additional features are increased, then the functionality is improved, but the heat generation in driver ICs increases

Engineering Contradiction:

Improveadditional featuresVSAvoidheat generation

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The FPC structure is enhanced to perform multiple functions simultaneously: electrical connection, signal transmission, and thermal management. The heat radiation layer integrated into the FPC enables the same component to handle both electrical and thermal aspects, making the system more versatile without adding separate dedicated cooling components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Device complexity

If the driver IC is mounted closer to the display area, then the device structure is simplified, but the heat affects the display performance

Engineering Contradiction:

Improvemounting structureVSAvoidheat impact on display

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The heat radiation layer serves as a thermal intermediary between the driver IC and the display area. Even when the driver IC is mounted close to the display, this intermediate layer captures and dissipates heat before it can reach the display elements, protecting the display from thermal damage while allowing compact mounting arrangements.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively manages heat dissipation from the driving IC chip, preventing excessive temperature increases and ensuring the reliability and performance of the display device.

Implementation Method 1

a heat radiation layer thermally connected to the drive circuitry

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

heat radiation layer... radiates heat away from the driving IC chip

Methodology Applied

Scientific EffectHeat radiation: Thermal Radiation

Data Source

PatentUS10459554B2Display device

Publication Date: 2019.10.29 MAGNOLIA WHITE CORP

AI summary

According to one embodiment, a display device includes a first substrate including a display area containing a plurality of pixels and a non-display area, a drive circuitry on the non-display area of the first substrate and connected to the plurality of pixels, a second substrate opposed to the first substrate, a touch sensor including detection electrodes on the second substrate, and a third substrate including first wiring lines connected to the detection electrodes and a heat radiation layer thermally connected to the drive circuitry.