Modified Silicone Resin for PCB Thermal Expansion
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Solution Overview
Problem
Current resin compositions for laminated plates in printed wiring boards face challenges with high water absorbability and thermal expansion, leading to reliability issues and low productivity, particularly in high-density and multi-layered structures.
Innovation Solution
A modified silicone compound is developed by reacting a siloxane diamine, a maleimide compound with N-substituted maleimide groups, and an amine compound with acidic substituents, forming a thermosetting resin composition that includes epoxy or cyanate resins and inorganic fillers, which is used to create a prepreg and laminated plate with improved properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the amount of inorganic filler is increased to lower thermal expansion, then heat resistance is improved, but insulation reliability deteriorates due to moisture absorption
Solution Approach 1:
The patent changes the chemical composition parameters of the resin system by introducing a modified imide resin with specific molecular structure (containing aromatic rings and imide groups) to achieve both low thermal expansion and low moisture absorption. The resin composition is optimized with specific ratios of imide resin, epoxy resin, and inorganic filler to balance these competing requirements.
Solution Approach 2:
The patent creates a composite resin system combining modified imide resin, epoxy resin, and inorganic filler in specific proportions. This composite approach allows the material to simultaneously achieve low thermal expansion (from imide resin), good adhesion (from epoxy resin), and controlled moisture absorption (from the optimized composite structure).
2Temperature
If poly-bis-maleimide resin is used to achieve excellent heat resistance, then thermal stability is improved, but productivity deteriorates due to higher lamination temperature and time
Solution Approach 1:
The patent modifies the curing temperature parameter by developing a resin system that cures at lower temperatures (150-200°C) compared to conventional poly-bis-maleimide resin (220°C or higher). This temperature reduction enables faster production cycles while maintaining the heat resistance benefits of imide-based chemistry.
Solution Approach 2:
The patent uses a modified imide resin that provides sufficient heat resistance for the application without requiring the extreme curing conditions of conventional poly-bis-maleimide resin. This approach sacrifices some of the maximum possible thermal stability to gain significant productivity improvements, which is acceptable for many electronic applications.
3Stability of the object's composition
If epoxy resin with aromatic rings is used to lower thermal expansion, then coefficient of thermal expansion is reduced, but heat resistance improvement is limited
Solution Approach 1:
The patent combines epoxy resin (providing low thermal expansion through its aromatic structure) with modified imide resin (providing high heat resistance) in a composite system. The synergistic effect of this combination achieves both low coefficient of thermal expansion and high heat resistance, overcoming the limitations of using epoxy resin alone.
Solution Approach 2:
The patent merges the beneficial properties of epoxy resin (low thermal expansion) and imide resin (high heat resistance) into a single composite material system. This combination allows the resin to simultaneously exhibit both low coefficient of thermal expansion and excellent heat resistance, which neither component could achieve alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting prepreg and laminated plate exhibit excellent low water absorbability and low thermal expansion, enhancing the reliability and productivity of printed wiring boards for electronic devices.
Implementation Method 1
A modified silicone compound is developed by reacting a siloxane diamine, a maleimide compound with N-substituted maleimide groups, and an amine compound with acidic substituents
Implementation Method 2
The thermosetting resin composition, which comprises the modified silicone compound, is used to create a prepreg and laminated plate
Data Source
AI summary
There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance. Therefore, the multi-layered printed wiring board is useful as a highly integrated semiconductor package and a printed wiring board for an electronic device.