Flexible Circuit Heat Dissipation in Display Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display devices face issues with heat dissipation in flexible circuits, leading to potential failure or self-burning due to high temperatures generated during operation.
Innovation Solution
Incorporating a heat conductive structure between the flexible circuit and an outer frame, which includes a heat dissipating layer and a heat conductive layer, to facilitate efficient heat dissipation from the flexible circuit to the outer frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the flexible circuit is used to connect the liquid crystal panel and driver circuit board, then the connection flexibility is improved, but the heat dissipation performance deteriorates causing high temperature and potential failure
Solution Approach 1:
A heat conductive structure is introduced as an intermediary component between the flexible circuit and the back plate. This mediator transfers heat from the flexible circuit to the back plate, resolving the heat accumulation problem while preserving the flexible circuit's connectivity function.
Solution Approach 2:
The heat dissipation function is extracted from the flexible circuit itself and transferred to a dedicated heat conductive structure. This separation allows the flexible circuit to maintain its electrical connection function while the heat conductive structure handles thermal management.
2Adaptability or versatility
If the flexible circuit extends across the sealant frame to connect components, then the structural adaptability is improved, but the heat accumulation worsens due to restricted heat dissipation paths
Solution Approach 1:
The heat dissipation path is extended from a two-dimensional surface contact to a three-dimensional structure by introducing a heat conductive layer with varying thickness. The thicker portion provides an additional heat transfer dimension, improving thermal conductivity without compromising the flexible circuit's structural adaptability.
3Temperature
If a rigid heat conductive structure is used to improve heat dissipation, then the heat dissipation performance is improved, but the flexibility and risk of abrasion to the flexible circuit worsens
Solution Approach 1:
The heat conductive structure is designed as a flexible thin film layer that can bend and deform with the flexible circuit. This flexible heat conductive layer provides effective thermal conduction while avoiding the abrasion and damage problems associated with rigid heat sinks.
Solution Approach 2:
The heat conductive structure uses composite material design combining heat conductive properties with flexibility. The composite structure achieves both thermal management effectiveness and mechanical compatibility with the flexible circuit, preventing abrasion while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation performance, preventing overheating and potential damage to the flexible circuit, while maintaining flexibility to avoid abrasion issues.
Implementation Method 1
a heat conductive structure located between the flexible circuit and the outer frame and contacting both of the flexible circuit and the outer frame
Data Source
AI summary
A display device is disclosed. The display device includes: a back plate; a display panel located at a displaying side of the back plate; a driver circuit board located at a non-displaying side of the back plate; an outer frame; a flexible circuit located at least partially between the back plate and the outer frame to connect the driver circuit board with the display panel; and a heat conductive structure located between the flexible circuit and the outer frame and contacting both of the flexible circuit and the outer frame.