Vertical Antenna Structure for Compact Electronic Package
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Solution Overview
Problem
Conventional wireless communication modules face challenges in miniaturization due to the inability to integrally fabricate the antenna body with electronic elements, leading to increased module size and inefficient packaging processes.
Innovation Solution
A vertical type antenna structure with a base portion and support portion is implemented, allowing the antenna to be disposed on the substrate where electronic elements are mounted, enabling a smaller mold size and complete encapsulation, thus reducing the overall package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a planar-type antenna structure is used, then the antenna can be fabricated on the substrate surface, but the antenna body cannot be integrally fabricated with electronic elements and requires additional substrate area
Solution Approach 1:
The patent transitions from a planar two-dimensional antenna structure to a three-dimensional vertical antenna structure. The antenna body extends vertically from the substrate surface with a height greater than its horizontal dimensions, utilizing the third dimension (height) to achieve compactness while maintaining integral fabrication with electronic elements on the substrate.
2Ease of manufacture
If the antenna body is exposed from the encapsulant, then the antenna structure can be formed, but the packaging process requires a mold with size corresponding to electronic element-mounting area only
Solution Approach 1:
The patent merges the antenna structure with the encapsulant by completely enclosing the antenna body within the encapsulant material. The encapsulant serves dual functions: protecting electronic elements and housing the antenna structure, thereby unifying the packaging process and eliminating the need for separate antenna fabrication steps.
3Adaptability or versatility
If additional substrate area is allocated for antenna disposal, then the antenna structure can be implemented, but the overall module size increases
Solution Approach 1:
The patent employs a vertical antenna configuration where the antenna body extends primarily in the vertical dimension (height) rather than occupying additional horizontal substrate area. This dimensional transition allows the antenna to be disposed within the existing substrate footprint, maintaining miniaturization while enabling antenna functionality.
Solution Approach 2:
The antenna structure is nested within the encapsulant volume, utilizing the three-dimensional space created by the encapsulation process. The antenna body is positioned within the encapsulant's spatial envelope, effectively nesting one functional element within another without requiring additional external space.
Data Source
AI summary
An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.