Folding USB Drive Flexible Substrate Assembly
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Solution Overview
Problem
There is a need for a flash memory drive that offers increased memory capacity while maintaining a compact size, and can be manufactured at reduced costs, with the ability to connect to a wide range of devices via a universal serial bus (USB) interface, and be conveniently packaged for transport.
Innovation Solution
A USB flash drive utilizing a thin, flexible substrate laminate with test pads and traces for mounting flash memory chips, allowing for manufacturing and testing in an unfolded state before being assembled into a compact housing body, which includes a USB connector and optional display for memory capacity indication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If flash memory chips are mounted on a thin, flexible substrate laminate, then manufacturing costs are reduced and assembly is simplified, but the substrate must be folded to achieve compact size
Solution Approach 1:
The patent employs a thin, flexible substrate laminate (flexible circuit board) to mount flash memory chips, replacing traditional rigid PCBs. This flexible substrate can be folded into a compact configuration while maintaining electrical connections, thereby reducing manufacturing costs and enabling compact device form factor.
Solution Approach 2:
The substrate is designed with fold lines that allow it to transition between an unfolded state during manufacturing/testing and a folded state for final assembly. This dynamic reconfiguration enables the same component to serve different functional requirements at different stages of the product lifecycle.
2Volume of moving object
If the USB flash drive uses a flexible substrate that can be folded, then compact size is achieved, but manufacturing and testing must be performed in an unfolded state
Solution Approach 1:
The patent performs all manufacturing and testing operations while the flexible substrate is in its unfolded state, ensuring proper electrical connections and component functionality. After verification, the substrate is folded into the compact configuration for final assembly. This preliminary action approach ensures quality while enabling compact final form.
3Quantity of substance
If multiple flash memory chips are mounted on the flexible substrate, then memory capacity is increased, but the substrate area required increases
Solution Approach 1:
The patent mounts flash memory chips on both sides (upper and lower surfaces) of the flexible substrate, utilizing the third dimension (depth/thickness) rather than expanding the two-dimensional planar area. This allows multiple chips to be accommodated within a compact footprint, increasing memory capacity without proportionally increasing the device area.
Data Source
AI summary
Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper and lower surfaces. The flash memory chip may be configured as one of a thin small outline package (TSOP) package device, a very very small outline package (WSOP) package device, and a chip on board (COB) device. The memory device may further comprise a hollow housing body having a hollow interior compartment sized and configured to receive the circuit assembly therewithin. A universal series bus (USB) connector may be mounted on a free end of the flexible substrate and is preferably configured to electrically connect the memory device to an electric device.