Display Panel Conductive Pattern for Low Resistance and Fewer Pseudo Defects
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Solution Overview
Problem
Display panels face challenges in achieving low resistance lines for high-speed operation and reduced power consumption, while maintaining reliability and preventing pseudo defects in manufacturing processes.
Innovation Solution
A display panel design featuring a conductive pattern with a first conductive layer, a blocking layer, and an intermediate alloy layer, where the intermediate layer is formed by diffusing the second conductive layer into the blocking layer, and a shielding layer with reduced light transmittance, enhancing conductivity and protecting against etching gases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a conventional conductive pattern with single or dual layers is used, then the manufacturing process is simple, but the line resistance is high and power consumption increases
Solution Approach 1:
The conductive pattern is segmented into multiple functional layers: a first conductive layer (aluminum) for primary conductivity, a blocking layer (titanium nitride) to prevent excessive diffusion, and a second conductive layer (titanium) that diffuses into the blocking layer to form an intermediate alloy layer. This segmentation allows each layer to perform its specific function while collectively reducing line resistance and power consumption.
Solution Approach 2:
The conductive pattern uses composite materials with different properties: aluminum provides low resistance, titanium nitride provides diffusion blocking, and titanium provides structural stability and controlled diffusion. The intermediate layer formed by diffusion creates an alloy composite that optimizes both conductivity and adhesion, reducing overall line resistance and power consumption.
2Reliability
If the second conductive layer diffuses extensively into the blocking layer, then adhesion improves, but excessive diffusion causes pseudo defects in optical inspections
Solution Approach 1:
The diffusion process parameters are precisely controlled: the first heat treatment is performed at 600°C or lower for a specific duration, and the blocking layer thickness is optimized at 50-200 nm. These parameter changes ensure sufficient diffusion for adhesion while limiting excessive diffusion that would create pseudo defects visible in optical inspections.
Solution Approach 2:
The blocking layer acts as an intermediary between the first and second conductive layers, controlling the diffusion process. It allows controlled diffusion to form the intermediate alloy layer for adhesion while preventing excessive diffusion that would create defects. The blocking layer mediates the interaction between the two conductive layers to achieve optimal adhesion without pseudo defects.
3Object-affected harmful factors
If a shielding layer with reduced light transmittance is added, then protection against etching gases improves, but optical inspection difficulty increases
Solution Approach 1:
The shielding layer is segmented into multiple sub-layers with different functions: a first shielding layer (amorphous carbon) for primary etching gas protection with high light transmittance, and a second shielding layer for enhanced protection with reduced light transmittance. This segmentation allows the first layer to maintain optical inspection capability while the second layer provides additional protection where needed.
Solution Approach 2:
The shielding layer properties are optimized locally: the amorphous carbon layer is applied with controlled thickness (5-20 nm) to achieve the right balance between etching gas protection and light transmittance. The local quality of the carbon layer varies to provide sufficient protection in critical areas while maintaining optical inspection capability in other areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces line resistance, improves display resolution, and decreases power consumption while minimizing pseudo defects in optical inspections, thereby enhancing manufacturing reliability and display performance.
Implementation Method 1
the fourth layer diffuses into the third layer to form an intermediate layer, and the intermediate layer includes an alloy of a material of the fourth layer and a material of the third layer
Implementation Method 2
performing a second heat treatment for crystallizing the semiconductor pattern
Implementation Method 3
performing a second heat treatment for crystallizing the semiconductor pattern
Data Source
AI summary
A display panel includes: a base substrate; a light emitting element on the base substrate; a transistor between the base substrate and the light emitting element, and connected with the light emitting element; and a conductive pattern between the base substrate and the light emitting element. The conductive pattern includes: a first conductive layer including a first material; a second conductive layer on the first conductive layer, and including a second material different from the first material; a blocking layer between the first conductive layer and the second conductive layer, and including a third material different from the first material; and an intermediate layer between the blocking layer and the second conductive layer, and contacting the second conductive layer. The intermediate layer includes an alloy of the first material and the second material.