Reducing Contact Resistance in Display Panels via Sacrificial Metal Oxide
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Solution Overview
Problem
In TFT-LCD display panels, particularly full-in-Cell touch products, the contact resistance between the conductive material used for the source/drain electrode and the common electrode layer is excessively high due to the presence of an interface oxide, which deteriorates display and touch performance.
Innovation Solution
A method involving the formation of a first metal layer, a second metal layer with a sacrificial oxide, and a conductive layer, where the second metal layer is oxidized and then removed to expose the first metal layer, reducing contact resistance by preventing oxide formation on the surface of the first metal layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a common electrode layer is connected with source/drain electrode layer using conductive material in LTPS process, then the display panel can transmit signals during display and touch phases, but the contact resistance between the conductive material and common electrode layer becomes excessively high due to interface oxide formation
Solution Approach 1:
The patent applies preliminary action by forming a protective metal layer on the common electrode layer before depositing the conductive material. This protective layer prevents oxide formation at the interface in advance, ensuring low contact resistance when the conductive material is later deposited. The protective layer is removed only after serving its protective function, demonstrating preliminary protection followed by removal.
Solution Approach 2:
The patent uses an intermediary approach by introducing a protective metal layer as a mediator between the common electrode layer and the conductive material. This intermediary layer prevents direct contact between the conductive material and oxide-prone surfaces, thereby reducing contact resistance. The protective layer acts as a temporary mediator that is removed after serving its protective purpose.
2Ease of manufacture
If interface oxide is present between conductive wires, then the manufacturing process is simplified, but the contact resistance increases and deteriorates display and touch performance
Solution Approach 1:
The patent applies preliminary action by forming a protective metal layer on the common electrode layer before depositing the conductive material. This protective layer prevents oxide formation at the interface in advance, ensuring low contact resistance when the conductive material is later deposited. The protective layer is removed only after serving its protective function, demonstrating preliminary protection followed by removal.
Solution Approach 2:
The patent applies parameter changes by modifying the surface properties of the common electrode layer through the protective metal layer. This changes the electrical and chemical parameters at the interface, reducing contact resistance and improving signal transmission performance while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces contact resistance between the metal layers, enhancing the display and touch performance of the panel by forming a good electrical contact between the conductive and source/drain electrode layers.
Implementation Method 1
oxidizing a portion of the second metal layer to form an oxide extending to a surface of the first metal layer
Implementation Method 2
the oxide is removed by wet etching using the isolation layer as a protective layer
Data Source
AI summary
The present disclosure relates to a method for manufacturing a display panel, a display panel and a display device. There is provided a method for manufacturing a display panel, comprising: forming a first metal layer on a substrate; forming a second metal layer on the first metal layer; oxidizing a portion of the second metal layer to form an oxide extending to a surface of the first metal layer; removing the oxide to expose the surface of the first metal layer; and forming a conductive layer on the exposed surface of the first metal layer.