Flexible Display Panel Inorganic Encapsulation Thinning
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Solution Overview
Problem
Conventional flexible display screens face issues with cracks during bending, leading to water-oxygen invasion and reduced quality and reliability due to the thickness of the inorganic encapsulation layer.
Innovation Solution
A fabrication method involving the formation of multiple inorganic encapsulation layers with a thinning process using dry etching, where the first and second inorganic layers are retained in specific regions, and the third layer is thinned to form a third encapsulation layer with an arc-shaped slope, reducing overall thickness and improving bending resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a thin film encapsulation technology is used to form the encapsulation layer, then the display screen can be made flexible and thin, but the inorganic encapsulation layer thickness becomes substantially large (approximately 1 μm) and cracks appear during bending process
Solution Approach 1:
The encapsulation layer is divided into multiple thin inorganic encapsulation layers (first, second, and third inorganic encapsulation layers) with different thicknesses and spatial distributions. The first inorganic encapsulation layer is retained in the first region, the second inorganic encapsulation layer is retained in the first region, and the third encapsulation layer is formed by thinning the third layer. This segmentation allows each layer to provide specific protection while maintaining overall flexibility and preventing cracks during bending.
2Reliability
If the inorganic encapsulation layer thickness is increased to provide better protection, then encapsulation reliability improves, but the display screen becomes less flexible and more prone to cracking during bending
Solution Approach 1:
Different regions of the encapsulation structure have different thickness characteristics. The first inorganic encapsulation layer and second inorganic encapsulation layer are retained in the first region with specific thicknesses, while the third encapsulation layer is formed by thinning the third layer. This local quality variation provides enhanced protection where needed while maintaining flexibility in other areas, preventing uniform cracking during bending operations.
3Reliability
If multiple inorganic encapsulation layers are formed with different thicknesses, then bending resistance improves, but the manufacturing process complexity increases
Solution Approach 1:
The formation of multiple inorganic encapsulation layers with different thicknesses is achieved by combining several processes: forming a first inorganic material layer, forming a second inorganic material layer, forming a third layer, and then selectively thinning these layers through etching. This merging of processes creates a complex multi-layer structure with varying thicknesses that provides superior bending resistance while maintaining manufacturing feasibility through integrated process steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the bending properties of the display panel, prevents cracks, and improves the reliability and quality by maintaining a thin encapsulation layer structure, allowing for better protection against external substances.
Implementation Method 1
patterning the first inorganic layer and the second inorganic layer by a dry etching using the third layer as a mask, while simultaneously thinning the third layer
Data Source
AI summary
A display panel and a fabrication method for forming the display panel are provided. The fabrication method includes providing a substrate disposed with a light-emitting device, and forming a first inorganic material layer. The fabrication method also includes forming a first inorganic layer by thinning the first inorganic material layer, and forming a second inorganic layer. Moreover, the fabrication method includes forming a third layer. The third layer is disposed in a first region. Further, the fabrication method includes patterning the first inorganic layer and the second inorganic layer by a dry etching using the third layer as a mask, while simultaneously thinning the third layer. The first inorganic layer and the second inorganic layer in the first region are retained to form a first inorganic encapsulation layer and a second inorganic encapsulation layer, respectively. The third layer is thinned to form a third encapsulation layer.