Display Panel Encapsulation Layout to Prevent Etching Residues
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Solution Overview
Problem
The existing display panels face issues due to a steep tilt angle in the encapsulation layer, leading to metal residues during the etching process for metal wirings, which results in internal short circuits and reduced reliability and performance of the display panel.
Innovation Solution
A display panel design that includes a substrate, an inorganic insulating layer, an organic insulating layer with a dam and organic insulating portion, a light emitting layer, and an encapsulation layer with varying thicknesses. The encapsulation layer covers the organic insulating portion but does not extend to the wiring holes, ensuring a smooth transition and reducing the risk of metal residues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the encapsulation layer has a large tilt angle at the position between the display area and the bonding area, then the encapsulation layer transitions steeply in this area, but the large etching amount makes the roughness of the surface of the layers larger, causes metal residues to remain, and the flatness of the formed layer is poor
Solution Approach 1:
The patent divides the encapsulation layer into multiple segments with different thicknesses: a first encapsulation portion in the display area, a second encapsulation portion in the bonding area, and an intermediate encapsulation portion connecting them. This segmentation allows each portion to have optimized thickness and tilt angle characteristics, resolving the contradiction between steep transition and manufacturing precision.
Solution Approach 2:
The patent applies local quality by making different portions of the encapsulation layer have different thickness characteristics. The first encapsulation portion has greater thickness for protection, the second has appropriate thickness for bonding, and the intermediate portion has gradually varying thickness to achieve smooth transition with controlled tilt angle, preventing metal residues while maintaining overall encapsulation effectiveness.
2Shape
If the encapsulation layer has a large tilt angle at the position between the display area and the bonding area, then the encapsulation layer transitions steeply in this area, but metal residues remain at the position corresponding to the tilt angle, leading to short circuit problems
Solution Approach 1:
By segmenting the encapsulation layer into first, second, and intermediate portions with different thickness characteristics, the patent creates a gradual transition zone that reduces the tilt angle in the intermediate portion. This segmentation prevents metal residues during etching while maintaining the necessary encapsulation structure, thereby preventing short circuits and improving reliability.
Solution Approach 2:
The patent performs preliminary action by pre-designing the intermediate encapsulation portion with gradually varying thickness before the etching process. This pre-configuration ensures that the tilt angle is controlled within an appropriate range before metal wiring formation, preventing metal residues from forming in the first place rather than attempting to remove them afterward.
3Shape
If the encapsulation layer transitions steeply in the area between display area and bonding area, then the thickness changes rapidly, but the flatness of the formed layer is poor
Solution Approach 1:
The patent segments the encapsulation layer thickness transition into multiple zones: the first encapsulation portion maintains greater thickness for display area protection, the second encapsulation portion has appropriate thickness for bonding, and the intermediate encapsulation portion provides a gradual thickness transition. This segmentation converts a single steep transition into multiple gentler transitions, improving flatness while maintaining necessary thickness variations.
Solution Approach 2:
The patent applies the curvature principle by designing the intermediate encapsulation portion with a gradually varying thickness profile rather than a linear or abrupt transition. This curved/thickened intermediate portion creates a smooth thickness transition that reduces the tilt angle, thereby improving the flatness of the formed layer and manufacturing precision.
Data Source
AI summary
A display panel and a display device are provided in the embodiments of the present invention, the display panel comprising a substrate, an inorganic insulating layer, an organic insulating layer, a light emitting layer and an encapsulation layer, wherein the organic insulating layer comprises an organic insulating portion, and the encapsulation layer covers at least part of the organic insulating portion and does not extend to a first wiring hole of the organic insulating layer. By forming an etched groove of the encapsulation layer on a side surface or a top surface of film layers of the display panel with a plurality of different etching processes, the etching effect of the encapsulation layer and the overall performance of the display panel are effectively improved.