Display Panel Manufacturing via Dynamic Exposure Correction
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Solution Overview
Problem
Conventional liquid crystal display panel manufacturing methods face challenges in achieving homogeneous image quality due to source-drain thinning and variations in thin film thickness and etching magnitude, leading to inhomogeneity in image quality, especially in large-size displays.
Innovation Solution
A display panel manufacturing method that involves forming a photosensitive resist film, exposing it based on numerically expressed design patterns, developing the resist, etching, and measuring the complete dimensions of the thin-film patterns, with subsequent correction of design patterns to minimize variances in dimensions and electric characteristics, using a direct-drawing exposure system to divide the exposure area into microscopic areas for precise control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional photo mask exposure method is used, then manufacturing process is simple, but image quality homogeneity deteriorates due to source-drain thinning and etching variations
Solution Approach 1:
The exposure area is divided into multiple microscopic areas, and exposure conditions are independently optimized for each area to compensate for local variations in thin film thickness and etching magnitude, thereby achieving homogeneous image quality across the entire display field
Solution Approach 2:
Different exposure conditions are applied to different regions of the substrate based on measured variations in thin film thickness and etching characteristics. This allows local compensation for source-drain thinning and other regional variations, improving overall image quality homogeneity
2Manufacturing precision
If exposure conditions are optimized for one region, then local manufacturing precision improves, but device complexity increases due to need for multiple exposure settings
Solution Approach 1:
The exposure system dynamically adjusts exposure conditions based on pre-measured data about thin film thickness and etching variations. The system automatically modifies exposure parameters for different regions without requiring manual intervention or complex mechanical adjustments
Solution Approach 2:
The system uses feedback from measured thin film thickness and etching characteristics to automatically adjust exposure conditions. This closed-loop approach optimizes local manufacturing precision while keeping the control system manageable through automated algorithms
3Manufacturing precision
If design patterns are corrected based on measured dimensions, then manufacturing precision improves, but loss of time occurs due to additional measurement and correction steps
Solution Approach 1:
Measurements of thin film thickness and etching characteristics are performed in advance before the exposure process. This allows design patterns to be pre-corrected based on actual variations, so that the exposure step itself can proceed efficiently without additional measurement delays during production
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively minimizes inhomogeneity in image quality by ensuring precise control over the dimensions and electric characteristics of thin-film patterns, thereby improving the uniformity of image quality across the display field.
Implementation Method 1
a photosensitive resist film is formed on the thin film formed on the substrate; exposing the resist film
Data Source
AI summary
A display panel manufacturing method in which forming a thin film on a substrate and etching the thin film are repeated a plurality of times to form on the substrate a plurality of scanning signal lines, a plurality of video signal lines that three-dimensionally intersects the plurality of scanning signal lines with an insulating layer between them, and TFT elements and pixel electrodes each disposed in a pixel area enclosed with two adjacent scanning signal lines and two adjacent video signal lines. The method also includes: exposing a resist film using exposure dimensions numerically expressed based on design patterns prepared in advance; etching the thin film using etching resists formed by developing the exposed resist film so as to form thin-film patterns; and correcting the design patterns according to the complete dimensions of the formed thin-film patterns.