Flexible Display Panel Groove Layout for Bend Stress Relief

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Solution Overview

Problem

Existing display technologies face challenges in achieving flexible and durable bending capabilities while maintaining efficient pixel performance and structural integrity, particularly in the design and fabrication of display panels with bending regions.

Innovation Solution

The display panel design incorporates a base layer with strategically defined grooves in inorganic and insulating layers to enhance flexibility, combined with a specific arrangement of thin-film transistors and encapsulation layers to support bending without compromising pixel functionality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If grooves are formed in inorganic and insulating layers to enhance flexibility, then bending capability is improved, but stress concentration and structural integrity deteriorate

Engineering Contradiction:
Improvebending capabilityVSAvoidstructural integrity
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The patent divides the inorganic and insulating layers into segmented regions with grooves formed at specific locations. These grooves segment the continuous layers, allowing controlled flexibility in bending regions while maintaining structural integrity in non-bending regions. The segmentation enables the display panel to bend without compromising overall strength.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies different structural qualities to different regions: grooves are formed only in specific inorganic and insulating layers at bending regions, while other layers maintain their continuous structure. This local differentiation allows the bending area to be flexible while the overall structure remains strong and intact.

Inventive Principle:
Principle #3Local quality

2Adaptability or versatility

If thin-film transistors are arranged to support bending, then flexibility is improved, but pixel performance and reliability deteriorate

Engineering Contradiction:
ImproveflexibilityVSAvoidpixel performance
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent performs preliminary arrangement of thin-film transistors and formation of grooves in inorganic and insulating layers before the bending process. This preliminary structuring ensures that when bending occurs, the thin-film transistors are already positioned to accommodate the stress, preventing performance degradation and maintaining reliability during flexing.

Inventive Principle:
Principle #10Preliminary action

3Stress or pressure

If grooves are formed in inorganic layers, then stress concentration is reduced, but manufacturing complexity increases

Engineering Contradiction:
Improvestress concentrationVSAvoidmanufacturing complexity
Core Design Contradiction:
Stress or pressureVSEase of manufacture

Solution Approach 1:

The patent segments the inorganic layers by forming grooves at specific locations rather than creating complex three-dimensional structures. This segmentation approach reduces stress concentration by creating controlled discontinuities that guide stress distribution, while the manufacturing process remains relatively simple using standard deposition and etching techniques.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentEP3832723B1Display panel and method of fabricating the same
Publication Date: 2026.03.25 SAMSUNG DISPLAY CO LTD
  • EP3832723B1 patent drawingFigure 1A
  • EP3832723B1 patent drawingFigure 1B
  • EP3832723B1 patent drawingFigure 2

AI summary

A display panel includes a base layer having a first region and a bent second region. An inorganic layer is disposed on the base layer. A lower groove is formed within the inorganic layer and overlaps the second region. A first thin-film transistor is disposed on the inorganic layer and includes a silicon semiconductor pattern overlapping the first region. A second thin-film transistor is disposed on the inorganic layer and includes an oxide semiconductor pattern overlapping the first region. Insulating layers overlap the first and second regions. An upper groove is formed within the insulating layers. A signal line electrically connects the second thin-film transistor. An organic layer overlaps the first and second regions and is disposed in the lower and upper grooves. A luminescent device is disposed on the organic layer and overlaps the first region.