Display Panel Indentation Bonding Strength
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Solution Overview
Problem
The bonding area in display panels is a weak point in terms of structural strength, making it susceptible to damage from external forces during improper assembly, and existing bonding methods do not adequately enhance the bonding strength between the substrate and circuit structure.
Innovation Solution
The display panel incorporates a substrate and circuit structure bonded via a first bonding adhesive, with at least one indentation in each area that the adhesive fills, using a combination of anisotropic conductive adhesive and additional adhesives to increase bonding strength and prevent adhesive overflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bonding adhesive is used to bond the substrate and circuit structure, then the bonding strength is improved, but the adhesive may overflow and affect display quality
Solution Approach 1:
The patent introduces through-holes in the circuit structure that allow the bonding adhesive to penetrate and fill internally, creating a porous absorption mechanism. This enables the adhesive to be contained within the structure rather than overflowing externally, simultaneously achieving strong bonding and precise control.
Solution Approach 2:
The patent moves the adhesive containment from a two-dimensional surface problem to a three-dimensional solution by creating through-holes that extend vertically through the circuit structure. The adhesive flows into the depth dimension of the through-holes, preventing surface overflow while maintaining bonding effectiveness.
2Strength
If the bonding area is enlarged to improve bonding strength, then the structural strength is improved, but the assembly complexity increases
Solution Approach 1:
The patent nests the bonding adhesive within the through-holes of the circuit structure, creating a hierarchical arrangement where the adhesive is contained inside the structural features rather than requiring separate bonding zones. This integration reduces the overall assembly complexity while maintaining enhanced bonding strength.
3Strength
If additional adhesives are used to enhance bonding strength, then the bonding strength is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent combines the bonding adhesive function with the structural through-holes, merging two separate functions (bonding and structural support) into a single integrated feature. The through-holes serve both as structural elements and as containment channels for the adhesive, simplifying the manufacturing process by reducing the number of separate components and steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced bonding strength between the substrate and circuit structure improves the structural integrity of the display panel, reducing the likelihood of damage from external forces and ensuring the quality of the display panel.
Implementation Method 1
The first bonding adhesive comprises a first anisotropic conductive adhesive, which is configured to at least partially fill one or more of the at least one first indentation
Implementation Method 2
The first bonding adhesive at least partially fills one or more of the at least one first indentation
Data Source
AI summary
A display panel and a display apparatus containing the display panel are disclosed. The display panel includes a substrate, a circuit structure, and a first bonding adhesive. The substrate has a first bonding area. The circuit structure has a second bonding area that opposingly faces the first bonding area. The first bonding adhesive is arranged between, and configured to contact the first bonding area and the second bonding area. At least one of the first bonding area or the second bonding area comprises at least one first indentation. The first bonding adhesive at least partially fills one or more of the at least one first indentation.