Circuit Bendability/Stretchability TRIZ Cases

Distributing back and front drive circuits on opposite sides of a flexible substrate reduces non-display region width, enabling ultra-narrow border displays.

Alternating high and low tensile stiffness stitch patterns in a knitted substrate absorb stress during stretching, protecting electronic component connections.

A link loopback device uses a flexible circuit board connected to a substrate to simulate actual transmission links for high-speed network testing.

Segments rigid electronics into modular units on flexible substrates to resolve the trade-off between structural stability and device flexibility.

Adhesive fills structural indentations between the substrate and circuit structure, preventing overflow while increasing bonding strength.

Staggered grooves on the LED mount bar sides allow widthwise bending, eliminating the need to connect multiple rigid bars.

A flexible substrate uses a non-linear elastic layer to achieve high stretchability.

Deforming the printed circuit board center plane achieves lateral connections without angled pins, reducing device complexity and production costs.

A printed circuit board uses a metal thin film on wiring traces to reduce signal transmission loss.

Folded-back elastic mounting boards prevent amplifier detachment during body movement, maintaining stable signal amplification characteristics.

Segmenting connection bridges into single-power-line types reduces bridge width, resolving the trade-off between signal reliability and stretchability.

A stretchable wiring board uses a segmented substrate design to prevent wrinkle interference during deformation.

A biosensor laminate integrates a moisture barrier layer overlapping the probe to maintain uniform humidity at the electrode interface.

An elastic wiring board incorporates an ion-migration resistant layer between electrode wirings and the substrate.

Multi-layered anisotropic conductive adhesive uses a metal-plated fabric core to prevent delamination from overfilling grounding holes.

Double-level metallization with geometric deviation restricts stretchability below the elastic limit, preventing interconnection breakage.

A flexible printed circuit board uses a segmented reinforcing element to manage bending radii and prevent track damage.

A solvent-based liquid metal composition extends decap time using a polymeric binder and tailored solvent mixture.

Segmented interposers withstand external impacts while preserving signal transfer efficiency between stacked printed circuit boards.

Variable hardness buffer layer prevents stress concentration and crease formation during flexible screen bending.

Staggered wirings with varying widths reduce stress concentration in bezel substrates, preventing peeling and breakage during chip-on-film encapsulation.

A flexible circuit board attaches to a rigid underlay with a rounded or chamfered angle between its surfaces.

Inner sidewall grooves in the middle frame receive under-screen fingerprint light sources, reducing display gaps and increasing screen-to-body ratio.

Reinforcement arrangements at bend regions reduce strain on the dynamic flex circuit during autofocus and optical image stabilization cycles.

Reinforcing layers around flexible circuit positioning holes prevent deformation under external forces to ensure accurate bonding.

A flexible printed circuit with bus bars adapts to inter-electrode pitch variations, reducing component count and assembly complexity.

Vacuum evaporation deposits liquid metal onto elastic substrates to create conductive paths that withstand over 300% elongation without fracturing.

Segmented insulating layers with varying dielectric loss minimize RF signal attenuation while maintaining cost-effective manufacturing processes.

Filled signal vias and low-roughness traces minimize degradation in rigid flex circuits transmitting above 14 Gb/s.