Solvent-Based Liquid Metal Ink for Extended Decap Time

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Solution Overview

Problem

Conventional liquid metal inks have short decap times, making them unsuitable for direct ink writing and stencil printing due to rapid drying, which limits their application in scalable solutions.

Innovation Solution

An optimized solvent-based liquid metal composition is developed, incorporating a polymeric binder and a solvent mixture that extends decap time while maintaining electrical conductivity, including solvents like TXIB and toluene, and a metallic filler to enhance stability and conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If toluene is used as the solvent in liquid metal ink, then the ink is easy to process and compatible with various tackifying chemistries, but the decap time is short (about a minute or less) causing the ink to dry too fast

Engineering Contradiction:
Improveease of processingVSAvoiddecap time
Core Design Contradiction:
Ease of operationVSDuration of action of moving object

Solution Approach 1:

The patent changes the solvent parameter from toluene (low boiling point, fast evaporation) to a high-boiling-point solvent or solvent mixture, fundamentally altering the evaporation rate to extend decap time while maintaining ease of processing characteristics

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses a composite solvent system combining high-boiling-point solvent with other components to achieve both extended decap time and good processability, creating a multi-functional solvent formulation

Inventive Principle:
Principle #40Composite materials

2Ease of operation

If conventional liquid metal ink is used, then the ink can be processed easily, but it dries too fast to be viable for scalable solutions requiring longer decap times

Engineering Contradiction:
Improveease of processingVSAvoidscalability
Core Design Contradiction:
Ease of operationVSProductivity

Solution Approach 1:

The patent modifies the solvent evaporation rate parameter by selecting high-boiling-point solvents, which directly enables longer decap times required for scalable printing processes while preserving ease of processing

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a dynamic solvent evaporation profile where the high-boiling-point solvent provides controlled, extended evaporation time that matches the requirements of scalable manufacturing processes

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves significantly longer decap times, allowing for the use of liquid metal inks in various printing techniques without sacrificing conductivity, enabling the creation of flexible and stretchable electronic circuits.

Implementation Method 1

Toluene is a volatile, low boiling point solvent. As a result, these LM inks have a short decap time

Methodology Applied
Scientific EffectEvaporation: Evaporation

Data Source

PatentUS20240132739A1Optimized solvent-based liquid metal compositions and methods of using same
Publication Date: 2024.04.25 META PLATFORMS TECHNOLOGIES LLC
  • US20240132739A1 patent drawing
  • US20240132739A1 patent drawing
  • US20240132739A1 patent drawing

AI summary

An optimized solvent-based liquid metal composition includes a solution and a liquid metal mixed with the solution. The solution includes at least one solvent and a polymeric binder dissolved in the at least one solvent. Additionally or optionally, the composition includes a metallic filler. The ingredients of the composition are tailored to extend decap time while maintaining other beneficial properties to permit the use of the composition in various printing techniques.