Interposer Segmentation for PCB Impact Resistance
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Solution Overview
Problem
Electronic devices face challenges in maintaining efficient signal and power transfer between printed circuit boards due to external impacts, which can damage the interposer and degrade transfer efficiency, and require adaptive solutions to accommodate various board shapes and enhance stiffness.
Innovation Solution
The implementation of additional interposers with loop-shaped openings and support structures between printed circuit boards to ensure robust electrical connections, adaptive shape compatibility, and enhanced stiffness, including conductive vias and support members to secure and shield electrical elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single interposer is used to connect printed circuit boards, then the device structure is simple, but the interposer is vulnerable to external impacts and signal transfer efficiency degrades
Solution Approach 1:
The patent divides a single interposer into multiple interposers (first interposer and second interposer) that are spatially separated and work in parallel. This segmentation allows the system to maintain signal transfer functionality even if one interposer is damaged, thereby improving reliability without excessive complexity increase.
Solution Approach 2:
The patent positions multiple interposers at different locations between the printed circuit boards, creating redundant connection paths before impact occurs. This prior cushioning approach ensures that if one interposer is damaged by external impact, the other interposers can still maintain electrical connection, preventing complete system failure.
2Area of stationary object
If the interposer follows the non-rectangular shape of the printed circuit board to maximize space utilization, then mounting space efficiency is improved, but the interposer becomes more vulnerable to external impacts
Solution Approach 1:
Instead of using one large interposer that follows the non-rectangular board shape, the patent segments the connection function into multiple smaller interposers positioned at different locations. This segmentation maintains space utilization while reducing the vulnerability of any single interposer to impact damage.
Solution Approach 2:
The patent applies different interposer configurations to different local areas between the printed circuit boards. By placing interposers at specific high-risk locations rather than uniformly across the entire area, the design optimizes both space utilization and impact resistance at critical points.
3Device complexity
If electrical elements are disposed on printed circuit boards and connected through a single interposer, then the device structure is simple, but signal and power transfer efficiency is degraded
Solution Approach 1:
The patent segments the signal and power transfer paths by using multiple interposers instead of a single interposer. This creates multiple parallel conduction paths, reducing the total resistance and improving signal and power transfer efficiency without significantly increasing overall structural complexity.
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in the inner space of the housing, a second printed circuit board disposed so as to overlap at least a portion of the first printed circuit board, when the first printed circuit board is viewed from above, a first interposer disposed between the first printed circuit board and the second printed circuit board, and electrically connecting the first printed circuit board and the second printed circuit board, and at least one second interposer which is disposed between the first printed circuit board and the second printed circuit board so as to be spaced apart from the first interposer when the first printed circuit board is viewed from above, and which electrically connects the first printed circuit board and the second printed circuit board.