Flexible Array Substrate Dual-Side Circuit Distribution for Narrow Borders

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Solution Overview

Problem

Current display technologies face challenges in achieving ultra-narrow borders or borderless displays due to the unavoidable wire on array (WOA) and gate driver on array (GOA) circuits, which occupy significant non-active area, especially as resolution increases from HD to ultra-HD, making it difficult to reduce the border width.

Innovation Solution

A manufacturing method for a flexible array substrate involves adhering a flexible substrate to a rigid support plate, forming back and front side driver circuits, creating holes for electrical connection, and distributing the circuit structure on both sides of the substrate to reduce the non-active area, allowing for ultra-narrow borders or borderless displays.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a rigid substrate is used for array substrate, then manufacturing process is simple, but it cannot be bent or folded and occupies large space

Engineering Contradiction:
ImproveflexibilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The array substrate is divided into multiple rigid panel sections that can be independently manufactured and then connected through flexible connections, allowing the overall structure to be both rigid in local areas and flexible in others

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The substrate structure transitions from a completely rigid 2D plane to a multi-dimensional structure incorporating flexible connections and foldable joints, enabling bending and folding capabilities while maintaining manufacturing feasibility

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If array substrate is bent to fit curved surfaces, then adaptability to different surfaces is improved, but liquid crystal molecules cannot be uniformly aligned

Engineering Contradiction:
Improvesurface adaptabilityVSAvoidliquid crystal alignment precision
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The curved surface is divided into multiple rigid panel sections, each maintaining a relatively flat local surface that ensures proper liquid crystal alignment, while the overall structure adapts to the curved surface through the arrangement of panels

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each local panel section maintains flat surface properties suitable for liquid crystal alignment, while the global structure achieves curvature adaptation through the configuration of multiple panels with different orientations

Inventive Principle:
Principle #3Local quality

3Productivity

If flexible array substrate is manufactured by winding coating method, then manufacturing efficiency is improved, but coating uniformity deteriorates

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidcoating uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The substrate manufacturing process is segmented into multiple sequential coating passes, with each pass covering a specific region, allowing for better control of coating thickness and uniformity while maintaining high production speed

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The substrate surface is pre-treated with specific surface energy modifiers before coating, ensuring optimal adhesion and uniform coating distribution during the rapid winding coating process

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentEP3561799B1Method for manufacturing flexible array substrate
Publication Date: 2021.07.28 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
  • EP3561799B1 patent drawingFigure 1
  • EP3561799B1 patent drawingFigure 2~3
  • EP3561799B1 patent drawingFigure 4~5

AI summary

Disclosed is a method for manufacturing a flexible array substrate. The method comprises: first attaching a flexible substrate (3) to a rigid support plate (1) to manufacture a back drive circuit (4) and manufacturing, on the back drive circuit (4), a protective layer (5); then, after tearing off and turning over the flexible substrate (3), re-attaching same to the rigid support plate (1), so that the protective layer (5) comes into contact with an adhesive layer (2); and then forming a via hole (6) in the flexible substrate (3) to manufacture a front drive circuit (7) and a display circuit, wherein the front drive circuit (7) is electrically connected to the display circuit, and the back drive circuit (4) is electrically connected to the display circuit by means of the via hole (6), thus manufacturing a flexible array substrate with circuit structures on two sides. By means of distributing circuit structures in a non-display region to two sides of the flexible substrate (3), the width of the non-display region can be reduced, thereby realising ultra-narrow border or borderless display.