Display Panel Connection Lead Coating for Corrosion Protection
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Solution Overview
Problem
The existing mini LED display apparatuses face issues with corrosion of side surface connection leads due to exposure of metal, leading to increased resistance and potential breakage, which affects the display quality and longevity.
Innovation Solution
A display panel design with a laminated connection lead structure, including a main conductive layer and buffer conductive layers, and a protective silicon nitride or nickel-phosphorus alloy and gold protection layer, which covers the exposed sides of the connection leads to prevent corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If side surface routing is used to implement electrical connection, then the bezel width is reduced, but the connection leads are exposed to water and oxygen causing corrosion
Solution Approach 1:
The connection lead employs a composite structure with multiple conductive layers (first conductive layer, second conductive layer, third conductive layer) with different properties. The first layer provides adhesion to the back plate, the second layer provides oxidation resistance, and the third layer provides low resistance conduction, creating a composite material system that simultaneously achieves narrow bezel and corrosion protection.
Solution Approach 2:
The second conductive layer is specifically designed to provide oxidation resistance, creating an inert protective environment for the main conductive layer. This layer acts as a barrier that prevents oxygen and water from reaching the copper-based third conductive layer, effectively creating a protected micro-environment that resists corrosion.
2Ease of operation
If metal connection leads are exposed on the side surface, then electrical connection is achieved, but oxidation and corrosion occur leading to increased resistance
Solution Approach 1:
The connection lead uses a composite structure where the third conductive layer (copper-based) provides excellent electrical conductivity for signal transmission, while the second conductive layer provides oxidation resistance. This composite approach maintains low resistance for easy electrical connection while preventing corrosion that would otherwise increase resistance and degrade signal stability.
Solution Approach 2:
Different portions of the connection lead structure have different functional qualities: the third conductive layer is optimized for electrical conduction (low resistance), the second conductive layer is optimized for oxidation resistance, and the first conductive layer is optimized for adhesion. This local differentiation of properties allows the connection lead to simultaneously achieve ease of electrical connection and long-term reliability.
3Ease of manufacture
If simple conductive layer structure is used, then manufacturing is simplified, but protection from corrosion is insufficient
Solution Approach 1:
The connection lead employs a composite structure of three conductive layers with distinct functions. While this increases structural complexity, each layer can be formed using standard sputtering or electroplating processes, making the manufacturing approachable with existing equipment. The composite structure provides superior corrosion protection that would be unachievable with a single-layer design.
Solution Approach 2:
The connection lead is segmented into three distinct conductive layers, each with a specific function: adhesion (first layer), oxidation resistance (second layer), and conduction (third layer). This segmentation allows each layer to be optimized independently for its specific purpose while maintaining overall manufacturing feasibility through sequential deposition processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the stability and longevity of the connection leads by protecting them from water and oxygen, reducing oxidation and maintaining stable signal transmission.
Implementation Method 1
oxidation resistance of the second buffer conductive layer is greater than that of the main conductive layer
Implementation Method 2
protecting them from water and oxygen, reducing oxidation
Implementation Method 3
adhesiveness between the first buffer conductive layer and the back plate is greater than that between the main conductive layer and the back plate
Implementation Method 4
implement electrical connection between the electrical devices on two opposite surfaces of a display panel
Data Source
AI summary
The present disclosure provides a display panel and a manufacturing method thereof, a display apparatus and a splicing display apparatus. The display panel includes: a back plate, at least one connection lead and a first protection layer. Each of the at least one connection lead includes a main conductive layer. The first protection layer includes a first portion on two sides of the main conductive layer of the connection lead in a width direction thereof.