Identification Means TRIZ Cases

A tuned ratio between pixel, bank, and filter openings boosts quantum dot light conversion efficiency and supports higher-quality display images.

Opposite-surface electrodes shield cross-substrate LED light paths, limiting rear leakage while maintaining transparent display apertures.

A low-haze protective layer over a reduced-pixel camera area improves light transmission and preserves optical clarity in narrow-bezel displays.

A reflective electrode and matrix of sub-light emitters boost micro-display brightness while keeping power use low and CMOS driving practical.

Dual adhesive layers with different creep balance strong bonding and cut-out filling to prevent lifting in double-curved display corners.

Openings in a foldable OLED support layer expose alignment marks for CCD and laser cutting without deep slotting, preserving strength and reducing cracks.

Partial pixels in boundary regions compensate for tile misalignment, reducing visible seams while preserving uniform light emission.

By forming light-emitting elements and drive circuits on separate layers before bonding, this case cuts micro LED transfer time and connection defects.

A deep recess lets the wavelength converter contact the sidewall and base, improving heat conduction, color purity, and luminance.

A non-overlapping light-shielding layer around the contact hole prevents shorts with the connection electrode and stabilizes OLED operation.

A curved inorganic capping layer protects the common electrode and focuses light, improving alignment, display quality, and manufacturing efficiency.

Closely spaced via holes tie power lines to the light-shielding structure, limiting threshold drift and uneven display brightness.

A cover layer over the third panel area keeps alignment marks readable after bending, improving alignment accuracy and removing extra films.

Optimizing capping layer thickness, edge distance, and refractive index suppresses shining edges, ghost images, and seam shadows in splicing displays.

Dummy patterns matched to sensor lines in non-emission areas cut external light reflection and visible pattern artifacts in integrated displays.

A constant-potential shield wiring blocks pixel noise while enabling overlap layout for higher aperture ratio, luminance, and lower power.

Phase separation and chemical strengthening help electronic glass resist micro-crack growth and improve drop durability without losing transparency.

Stacked color filters and optical fluid create reflective images with smooth motion, reducing LED eye strain and maintenance demands.

A sliding piece, limiting assembly, and pressing piece simplify LED display curvature adjustment while maintaining stable locking.

Multidirectional power-line routing connects driver chips to the cathode while reducing non-display area for narrow-frame displays.

Reverse bonding places the driving chip and flexible circuit board behind the display panel, freeing transverse space for battery installation.