Display Panel Reverse Bonding for Expanded Battery Space
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Solution Overview
Problem
Existing flexible OLED module structures face challenges in maximizing battery capacity due to the limited space required for the flexible printed circuit (FPC) and its components, which overlap with the battery area, necessitating a reduction in battery thickness and capacity.
Innovation Solution
A display apparatus design featuring a reverse bonding of the FPC to the IC chip, with a flexible substrate and metal layers without patterns in bending portions, allowing for a twice-reverse fold structure that saves transverse space and ensures bending performance, coupled with a supporting layer and groove structures to enhance flexibility and manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the FPC and its components are arranged in a conventional layout, then the bonding connection is established, but the transverse space is occupied which reduces battery installation space
Solution Approach 1:
The FPC is bonded to the back face of the display portion through a reverse fold structure, inverting the conventional bonding approach. This allows the FPC and driving chip to be positioned on the back face rather than occupying transverse space, thereby increasing battery installation area without compromising bonding functionality
Solution Approach 2:
The bonding structure transitions from a planar arrangement to a three-dimensional folded configuration. By introducing fold lines and creating vertical displacement through folding, the FPC is repositioned from the front/transverse area to the back face, effectively utilizing the Z-dimension to resolve space conflicts
2Reliability
If the insulating layer and metal layer have patterns in the bending portion, then the electrical connection is maintained, but the bending performance is compromised
Solution Approach 1:
The patterns in the insulating layer and metal layer are selectively removed from the bending portions. This extraction of conductive elements from the folded areas allows the bending structure to flex without constraint, maintaining bending performance while electrical connections are preserved through alternative routing in non-bending areas
3Quantity of substance
If the FPC is bonded in a conventional manner, then the connection is established, but the transverse space consumption reduces battery capacity
Solution Approach 1:
By inverting the bonding orientation and positioning the FPC on the back face through reverse folding, the transverse space previously occupied by the FPC assembly is freed up. This space can then be allocated to increase battery size and capacity
Data Source
AI summary
A display apparatus includes a driving chip, a flexible circuit board and a display panel. The display panel includes a display portion and a bonding portion on one side of the display portion, and the bonding portion includes a first bending portion, a first connection portion, a second bending portion and a second connection portion which are sequentially arranged in a direction with an increasing extending distance from the display portion. The driving chip is in bonding connection with the display panel in the first connection portion, the flexible circuit board is in bonding connection with the display panel in the second connection portion, the driving chip is disposed on a side of the first connection portion facing away from the display portion, and the flexible circuit board is disposed on a side of the driving chip facing away from the display portion.