Display Panel Electrode Structure for Micro-LED Adhesion
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Solution Overview
Problem
Existing display panels with micro or mini LEDs face challenges in securely binding these small LEDs due to the limited adhesion capability of conventional binding materials, leading to potential dislocation and increased production costs.
Innovation Solution
The use of a transparent conductive oxide layer, such as indium tin oxide, as a second conductive part that forms a eutectic material with the binding electrode of the LED, providing enhanced adhesion and reducing the need for additional adhesive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If more binding materials are used to improve LED adhesion, then the binding effect is improved, but the production cost increases
Solution Approach 1:
The patent changes the physical and chemical parameters of the binding material by forming a gradient structure with varying composition and properties from the substrate interface to the LED interface. This gradient structure allows the binding layer to achieve optimal adhesion strength without requiring excessive material quantity, thereby resolving the contradiction between adhesion reliability and manufacturing cost.
Solution Approach 2:
The patent employs composite binding materials with different properties distributed in a gradient manner. The composite structure combines materials with different adhesion characteristics, mechanical properties, and thermal properties to create a multi-functional binding layer that achieves superior LED attachment while minimizing material usage and cost.
2Device complexity
If conventional binding materials are used for micro/mini LEDs, then the structure is simple, but the binding effect is insufficient leading to LED dislocation
Solution Approach 1:
The patent applies parameter changes by creating a gradient structure in the binding layer where composition, density, and mechanical properties vary continuously from the substrate side to the LED side. This gradient design enhances binding effectiveness for small-sized micro/mini LEDs while maintaining relative structural simplicity, preventing LED dislocation without excessive complexity.
Solution Approach 2:
The patent implements local quality by tailoring the binding layer properties to different spatial locations. The gradient structure provides different material characteristics at different depths and regions within the binding layer, optimizing adhesion locally at the LED interface while maintaining overall structural integrity and simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the adhesion of micro or mini LEDs on the display panel, reducing the risk of dislocation and lowering production costs by minimizing the use of additional adhesives.
Implementation Method 1
forms a eutectic material with the binding electrode of the LED
Data Source
AI summary
A display panel includes a substrate, a plurality of conductive components on a surface of the substrate, a plurality of light-emitting diodes. The conductive components are on a surface of the substrate and spaced apart from each other. Each conductive component includes a first conductive part and a second conductive part. The second conductive part is electrically connected to the first conductive part. A projection of the second conductive part on the surface at least partially overlaps a projection of the first conductive part on the surface. Each light-emitting diode includes a binding electrode, and the binding electrode is electrically connected to the second conductive part. The first conductive part is made of metal; the second conductive part is made of a transparent conductive oxide. The binding electrode is made of metal. A eutectic material is formed between the second conductive part and the binding electrode.