Display Panel Electrode Layout for Low-Reflectivity Bonding

The patent extracts and removes the metal wired electrode from the display panel structure. Instead of using a separate metal wire electrode for bonding, the invention integrates the electrode function directly into the light emitting element structure, eliminating the metal wire that causes high reflectivity while maintaining electrical connection reliability through direct bonding of the light emitting element electrode to the drive substrate electrode.

The patent merges the electrode of the light emitting element with the bonding structure. The electrode of the light emitting element is directly bonded to the electrode of the drive substrate without an intermediate metal wire, combining the electrical connection function and the bonding function into a single integrated structure, thereby eliminating the reflective metal wire while ensuring reliable electrical connection.

The patent inverts the conventional bonding approach. Instead of bringing external metal wires up through openings to make connections, the invention has the electrode of the light emitting element directly contact and bond with the electrode of the drive substrate through the opening, reversing the direction and method of electrical connection establishment.

The light emitting element's own electrode serves as the bonding element. The electrode of the light emitting element directly bonds with the drive substrate electrode without requiring separate bonding wires or additional bonding materials, allowing the structure to bond itself using its inherent electrode.