Display Panel Metal Pattern Bonding Without Bezel Bending
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Solution Overview
Problem
Existing display devices face challenges in manufacturing efficiency and non-display area reduction, particularly in bonding circuit boards to the rear surface of the display panel without bending the non-display area, which can lead to defects.
Innovation Solution
A display device design featuring a display panel with a base layer and a circuit layer, including a pad electrode exposed through a first opening in the base layer, and a metal pattern that electrically connects the pad electrode to a circuit board. The metal pattern includes a first portion overlapping the opening and contacting the pad electrode, and a second portion contacting the circuit board without overlapping the opening.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the circuit board is bonded to the rear surface of the display panel by bending the non-display area, then the bonding process becomes simpler, but defects occur in the non-display area
Solution Approach 1:
The base layer is segmented into a display area and a non-display area, with the circuit board bonded only to the non-display area. This segmentation allows the circuit board to be attached without requiring bending of the entire display panel, thereby simplifying the bonding process while preventing defects in the display area.
Solution Approach 2:
The bonding function is extracted from the display area and relocated to the non-display area. By placing the circuit board on the rear surface of the non-display area only, the patent eliminates the need to bend the display area, thus avoiding defects while maintaining bonding capability.
2Reliability
If a connection electrode is added between the pad electrodes and metal patterns, then electrical connection is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges the function of the connection electrode with the metal pattern by making the metal pattern extend continuously from the pad electrode region to the circuit board bonding region. This integration eliminates the need for a separate connection electrode, simplifying the manufacturing process while maintaining reliable electrical connection.
Solution Approach 2:
The metal pattern serves multiple functions: it provides electrical connection from the pad electrode to the circuit board, and it also acts as a bonding interface for the circuit board. This multi-functionality eliminates the need for separate connection components, reducing manufacturing complexity.
3Strength
If the bezel area is increased to cover the non-display panel, then the structural integrity is improved, but the non-display area is increased
Solution Approach 1:
The patent moves the circuit board bonding location to the rear surface of the non-display area, utilizing the third dimension (depth/thickness) rather than expanding the horizontal bezel area. This allows structural integrity to be maintained through proper bonding positioning without increasing the visible non-display area from the front.
Data Source
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AI summary
A display device includes a display panel displaying an image, a circuit board coupled with the display panel, and a metal pattern electrically connecting the display panel and the circuit board. The display panel includes a base layer and a circuit layer disposed on the base layer and including a pad electrode exposed to an outside via an opening defined through the base layer. The metal pattern includes a first portion overlapping the opening and being in contact with the pad electrode and a second portion that does not overlap the opening and is in contact with the circuit board.