Display Panel Electrode Layout for Narrow-Seam Tiled Displays
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Solution Overview
Problem
The challenge in display technology is to assemble large-sized display devices by tiling small-sized display panels without causing fragmentation of the display picture, which requires reducing the frame size and tiling seam width, while ensuring reliable electrical connections and avoiding damage to the display panel's film layers during the manufacturing process.
Innovation Solution
The solution involves a display panel design with a substrate, first and second bonding electrodes, connecting leads, and an electrode carrier plate, where the second bonding electrodes are formed on the carrier plate and integrated onto the substrate, allowing for stable electrical connections and minimizing the risk of laser damage during manufacturing by avoiding overlap with the display area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connecting leads are formed by laser sputtering to ensure electrical connection, then electrical connectivity is achieved, but laser-induced damage to film layers occurs
Solution Approach 1:
The connecting lead is divided into three distinct portions: a first portion on the display surface, a second portion on the side face, and a third portion on the non-display surface. This segmentation allows the laser sputtering process to be applied in a controlled manner along the lead path, minimizing exposure to film layers while ensuring electrical connectivity throughout the connection path.
Solution Approach 2:
The connecting lead extends through three-dimensional space by utilizing the side face of the substrate as an intermediate path. Instead of forming leads solely on planar surfaces, the lead structure transitions from the display surface, along the side face, to the non-display surface, creating a spatial pathway that avoids direct laser exposure to sensitive film layers while maintaining electrical continuity.
2Shape
If frame size is reduced to enable tiling assembly, then display picture fragmentation is avoided, but manufacturing precision requirements increase
Solution Approach 1:
First bonding electrodes are pre-formed on the display surface and second bonding electrodes are pre-formed on the non-display surface before assembly. These preliminary electrode structures are positioned and prepared in advance, allowing for precise alignment during the tiling assembly process. The pre-formed electrodes include alignment features that facilitate accurate positioning when multiple panels are joined together.
Solution Approach 2:
The side face of the substrate serves as an intermediary structure that connects the display surface and non-display surface. The connecting leads pass through this intermediate region, providing a stable structural basis for electrical connection. This intermediary structure helps maintain geometric stability and alignment precision during the tiling assembly process, reducing the impact of reduced frame size on manufacturing precision requirements.
Data Source
AI summary
A display panel includes a substrate, first bonding electrodes, connecting leads, an electrode carrier plate and second bonding electrodes. The substrate includes a display surface, a non-display surface, and a selected side face. The display surface includes a first bonding area, and the non-display surface includes a second bonding area. The first bonding electrodes are arranged side by side at the intervals in the first bonding area. The connecting leads are arranged side by side at intervals, each connecting lead includes a first portion, a second portion and a third portion, and the first portion of each connecting lead is electrically connected to a first bonding electrode. The electrode carrier plate is arranged on the non-display surface and provided thereon with the second bonding electrodes arranged side by side at intervals, and each second bonding electrode is electrically connected to a third portion of a connecting lead.