Display Panel Side Encapsulation With Organic Layer Stacking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional encapsulation methods for sub-millimeter and micrometer LED panels using inorganic film layers result in unstable electrical properties due to sensitivity to oxygen and moisture, with side surface encapsulation exhibiting large thickness and inconsistent performance, often leading to defects like cracks and voids.
Innovation Solution
A display panel design featuring a dual encapsulation structure with alternately arranged organic coating and adhesive layers, where the coating layer directly covers the side surface of the driving substrate, reducing thickness and improving encapsulation performance by flattening surface roughness and absorbing external stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an inorganic film layer is used for side surface encapsulation, then encapsulation performance is improved, but the thickness becomes large and defects such as cracks and voids are easily generated
Solution Approach 1:
The patent changes the material parameter from inorganic to organic, which fundamentally alters the coating's ability to conform to rough surfaces. Organic materials have higher flexibility and adhesion properties that allow them to cover rough side surfaces at much smaller thicknesses while maintaining encapsulation effectiveness, eliminating the need for thick inorganic layers that develop cracks and voids.
Solution Approach 2:
The patent employs a composite encapsulation structure combining organic coating layers with adhesive layers. This composite approach leverages the moisture barrier properties of organic coatings and the bonding capabilities of adhesives, achieving effective encapsulation at reduced thickness compared to pure inorganic film structures.
2Reliability
If an inorganic film layer is used for encapsulation, then encapsulation performance varies, but the thickness increases and stability decreases
Solution Approach 1:
The patent changes the material parameter from inorganic to organic, which fundamentally alters the coating's ability to conform to rough surfaces. Organic materials have higher flexibility and adhesion properties that allow them to cover rough side surfaces at much smaller thicknesses while maintaining encapsulation effectiveness, eliminating the need for thick inorganic layers that develop cracks and voids.
Solution Approach 2:
The patent introduces adhesive layers as intermediary components between the substrate and organic coating layers. These adhesive layers provide stable bonding and stress distribution, ensuring consistent encapsulation performance across different conditions and eliminating the variability associated with inorganic film formation on rough surfaces.
3Reliability
If adhesive is used for side surface encapsulation, then encapsulation is achieved, but water vapor transmission rate is large requiring thicker formation
Solution Approach 1:
The patent employs a composite encapsulation structure combining organic coating layers with adhesive layers. This composite approach leverages the moisture barrier properties of organic coatings and the bonding capabilities of adhesives, achieving effective encapsulation at reduced thickness compared to pure adhesive or pure inorganic film structures.
Solution Approach 2:
The patent segments the encapsulation function into two distinct layers: adhesive layers for bonding and organic coating layers for moisture barrier protection. This segmentation allows each layer to be optimized for its specific function, with thin organic layers providing effective WVTR blocking without requiring the thickness needed for adhesive-only solutions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enhances encapsulation integrity and performance by reducing thickness, improving surface smoothness, and providing effective moisture barrier protection, while maintaining light transmittance and stability.
Implementation Method 1
a second encapsulation structure including at least one coating layer and at least one adhesive layer, where one of the coating layer and the adhesive layer directly covers the second surface of the driving substrate
Implementation Method 2
both the coating layer and the adhesive layer are organic layers... improving encapsulation performance by flattening surface roughness and absorbing external stress
Data Source
AI summary
A display panel and a splicing panel are provided. A driving substrate includes a second surface, and the second surface is a side surface of a driving substrate. A second encapsulation structure includes at least one coating layer and at least one adhesive layer. One of the coating layer and the adhesive layer directly covers the second surface of the driving substrate. In a vertical direction of the second surface of the driving substrate, the coating layer and the adhesive layer are alternately arranged, and both the coating layer and the adhesive layer are organic layers. The coating layer and the adhesive layer using organic materials can, flatten a roughness of the second surface, so as to improve an integrity of the coating layer and the adhesive layer, thereby improving an encapsulation performance.